Used MAT INC / MACHINE APPLICATION TOOLS GYR-840-4FN #9086138 for sale

MAT INC / MACHINE APPLICATION TOOLS GYR-840-4FN
ID: 9086138
Vintage: 2006
Grinder 2006 vintage.
MAT INC / MACHINE APPLICATION TOOLS GYR-840-4FN is a precision wafer grinding, lapping and polishing equipment designed specifically for modern semiconductor manufacturing. As part of the MAT GYR Series, it is an ideal system for back-grinding, lapping and polishing all types of semiconductor materials in wide range of sizes. MAT INC GYR-840-4FN unit has a robust user friendly design, which allows its operator to easily move the machine around from one operation to another while ensuring high precision, accuracy and repeatability. It is designed to perform chamfering, scuffing, back-grinding, edge rounding, lapping, polishing, buffing and surface finishing on semiconductor substrates. MACHINE APPLICATION TOOLS GYR-840-4FN includes a control module with accompanying software allowing for a comprehensive range of manual adjustments to further customize the process. The user-friendly control tool permits users to monitor and adjustly the pressure, vibration, and counter-rotation for the desired result, further allowing for more delicate operations on different sample geometries. GYR-840-4FN is equipped with a Static Balancing chuck for error compensation, an adjustable chuck stroke, and an adjustable chuck pressure for easy back-grinding of wafers with wafer-like thicknesses and flatness. It also offers advanced edge rounding features and a low radio frequency interference. It can also be equipped with upgraded vibration and counter-rotation features for improved accuracy and repeatability when grinding, lapping and polishing extremely small semiconductor substrates. MAT INC / MACHINE APPLICATION TOOLS GYR-840-4FN offers a wide range of features and configurations, including automatic brazing, beveling, and rounding options. It is also fully automated with a built-in grinding, lapping, and polishing process programmable in the software. The asset can also use high precision diamond pad to enable surface flatness, geometric parameters and repeatability. MAT INC GYR-840-4FN is the perfect model for back-grinding, lapping, and polishing of modern semiconductor materials of varied sizes. With the robust user-friendly design, advanced features, configurable settings, and automated programmable process, it is an ideal solution for producing high quality semiconductor wafers.
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