Used MELCHIORRE SP3 800 #9025179 for sale

ID: 9025179
Lapping machine.
MELCHIORRE SP3 800 wafer grinding, lapping & polishing equipment is a professional-grade tool designed specifically for accurate and efficient finishing of the surfaces of wafers used in semiconductor fabrication. The system has many features and capabilities that make it well-suited for both small-scale and large-scale wafer processing. To begin, SP3 800 has a unique grinding unit that allows for precision grinding of wafers to a tight tolerance. This is done by utilizing a Micro Point Controlled (MPC) grinding cycle. This cycle uses a computer to control the positioning of the wafers, as well as the speed and the pressure applied during grinding. This ensures a uniform surface finish with minimal grinding artifacts. MELCHIORRE SP3 800 also includes an advanced diamond lapping machine that allows for precise lapping and polishing of wafers to achieve the desired surface quality. This process uses an abrasive slurry combination to clean, remove particles, and smooth the surface of the wafer. This process also helps to create a uniform surface finish. SP3 800 is also equipped with a polishing station that allows for straight and curved polishing of wafers. This process is used to create a uniform, high-quality finish on the surface of the wafer that is free of scratches, pits, and other damage. The polishing station also has the ability to achieve different kinds of surface finishes depending on the type of material being processed. Finally, MELCHIORRE SP3 800 also has an automatic cleaning tool that removes particles created during the grinding and polishing cycles. This ensures that no contaminants remain on the finished surface, giving the wafer a pristine appearance. Overall, SP3 800 is a professional-grade tool that is essential for any semiconductor fabrication. It is able to accurately and efficiently grind, lap, and polish wafers to achieve the desired surface finish and quality. This asset can also help to reduce overall costs by reducing the time needed to process wafers and eliminating errors caused by manual grinding and polishing.
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