Used MITSUNAGA MFLN-6B2MT #293616748 for sale

MITSUNAGA MFLN-6B2MT Wafer Grinding, Lapping & Polishing equipment is designed specifically for polycrystalline and monocrystalline substrates such as Silicon and Wafers in the semiconductor industry. The system features a high performance grinding/polishing head with multi-axis platform technology, allowing it to be used for a variety of precision grinding, lapping and polishing processes. It is capable of processing substrates from 25mm to 300mm in diameter and offers consistent performance levels to a high standard of quality. The unit is equipped with an array of sensors to provide real-time feedback and control of its grinding/polishing parameters such as depth, pressure, rotational speed and tilt angle. It is capable of handling a wide range of substrates, including hard or soft surfaces as well as non-conductive substrates. The machine also includes a vacuum table which is used to firmly secure the wafer while it is being processed, ensuring precise and consistent grinding/polishing results. In terms of its grinding capability, MFLN-6B2MT is designed specifically for grinding and polishing of single-crystalline, polycrystalline, and amorphous surfaces. It is capable of precise grinding with a minimum of scratches and damages on the surface. It offers both continuous grinding and one-time grinding, along with a number of customizable parameters. The tool is also equipped with both diamond and silicon carbide grinding discs to provide the flexibility needed for numerous applications. The polishing capabilities of MITSUNAGA MFLN-6B2MT are designed for precision polishing of monocrystalline structure and high reflectivity for use in optical substrates with minimal damage. It offers both abrasive-free and abrasive polishing, allowing users to customize their polishing tasks accordingly. The asset is also equipped with an advanced polishing PLC, providing users with superior control of their polishing processes. This wafer grinding, lapping and polishing model is a highly advanced product with excellent performance, capable of delivering consistent and precise results. It is a must-have tool for any laboratory or production environment in which wafer grinding, lapping and polishing are necessary. It offers users a reliable, accurate and cost-effective solution for a wide range of tasks.