Used MITSUNAGA NH-6B2MT #9257649 for sale

MITSUNAGA NH-6B2MT is a state-of-the-art wafer grinding, lapping and polishing equipment designed to provide superior performance and exceptional value. This versatile model offers a wide range of features and capabilities, making it an ideal choice for processing a variety of semiconductor substrates. NH-6B2MT features a horizontal spindle with direct drive technology, allowing for consistent and precise treatment of semiconductor wafers of various configurations. It has a higher spindle speed of up to 1000 revolutions per minute and a longer stroke of 300 millimeters, providing greater flexibility in grinding, lapping and polishing applications. The unique design of the precision-aligned diamond polishing disc system also helps to ensure a superior surface finish with minimal deformation. The unit also includes a dynamic pressure control machine to ensure accuracy in grind, lap and polishing operations. With its air-cooled, direct drive tool, MITSUNAGA NH-6B2MT is able to operate at low speed without sacrificing efficiency or precision. This makes it an ideal choice for high-precision, low-noise applications. Additionally, NH-6B2MT is designed for maximum safety and ease of use, allowing operators to quickly adjust the settings and configurations for optimal performance. It has a wide variety of safety features, such as a low speed alert for operators working with high speed machines, a field control asset and a remote monitoring model designed to minimize potential problems. The heavy-duty construction and exceptional design of MITSUNAGA NH-6B2MT makes it one of the best wafer grinding, lapping, and polishing systems available today, providing superior performance and unbeatable value. Whether your needs are precision grinding, lapping, and polishing, NH-6B2MT offers a powerful solution to meet your requirements.