Used MOORE 450-CPZ #9395059 for sale

Name: MOORE 450-CPZ
Brand: MOORE
SKU: 9395059
Availability: InStock

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Wafer Grinding, Lapping & Polishing

Manufacturer

MOORE

Model

450-CPZ

ID: 9395059

Grinding machine FANUC Oi-MD Controller Y-axis: 10.5" CNC cross travel X-axis: 17.5" CNC longitudinal travel Z-axis: 3.5" CNC vertical travel 360° CNC rotation of C axis (Automatic C axis Normalcy) Rapid traverse rate: 60 IPM Contouring rate: 15 IPM Ultra-precision ball screws on the X and Y axes, with motors Encoders mounted directly on ball screws for high accuracy Precision roller bearing way system with accordion way covers Oil bath for ball screw FANUC Closed loop AC digital servo drive motors with quick connector FANUC Closed loop AC digital servo drive system (25 A peak) Automatic lubrication systems with low-level alarms for roller-way system Programmable, ball screw driven, Z-axis Programmable main spindle speeds CW / CCW / OFF (Planetary) Programmable chop grind ON / OFF with head-up micro switch Programmable air grinding spindle ON / OFF Programmable 110 VAC outlets ON / OFF Programmable U-axis outfeed Manual pulse generator (hand wheel) for easy setup X, Y, U, C and Z home switches with indicator lights X,Y, C and Z limit switches X,Y, C and Z limit switch indicator lights Minimum Programmable resolution: 0.000010" Pendant-type control cabinet mounted in a stand-alone electronics (3) Coats of high gloss epoxy paint Includes: Spindle bearing Outfeed bearing U-cup, packing, wiper, seal, and o-*ring Head thermometer Chop valves (2-way and 4-way) Micro switch Link and link pins Re-grind quill keyway Scraping of the column geometry correction Spotting of table surface The lapping of the table and saddle ways for proper roller bearing contact Accuracy: Positioning accuracy: 0.000080" Contouring accuracy: 0.000120" Control: 5-Axis, 32-byte, microprocessor CNC Graphics display with zoom functions Flat screen color LCD, 10.4" Sealed Mylar pushbutton keyboard with tactile and audible feedback Menu-driven editing and modification (10) Operating modes: Automatic, single block, playback, teach-in, dry run, jog / Zero setting, editing, input / Output, tool offsets, and special modes Automatic C-axis normalcy: Absolute / Incremental programming Inch / Metric conversion Standard 4 megabytes of memory Minimum resolution: 0.000010" Wheel compensation Manual federate override: 0-120% Mirror imaging Subroutines with nesting Linear interpolation Cartesian and polar coordinate programming Machine federate display Wheel radius compensation Program dwells Manual data input via keyboard Programmable zero offsets 3-axis simultaneous rapid positioning Scaling factors Help graphics Zoom up / Down Continuous and incremental jog Canned cycles Bolt circle programming Circular and rectangular pocket grinding Hole grinding cycles Controlled comer rounding Multiple absolute zeros Programmable safety limits DNC Communication RS-232 Communication.

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MOORE 450-CPZ Wafer Grinding, Lapping & Polishing System is a fully automated solution for grinding, lapping and polishing any size wafer. It is capable of producing sub-micron precision in a wide range of wafer sizes and thicknesses, from small dice wafers up to 8 inch diameter and thicknesses up to 10mm. It combines three processes in one machine, enabling it to grind, lap and polish in a single cycle. 450-CPZ is equipped with a high powered grinding motor, capable of achieving speeds of up to 12,000 RPM. This helps to achieve high levels of accuracy, without compromise. Its advanced electronics provide fully automatic control, allowing for precise operation and reproducible accuracy. MOORE 450-CPZ is equipped with a high precision CNC spindle, providing mechanical repeatability of less than a micron. The CNC spindle is capable of grinding, lapping and polishing using a range of abrasive materials such as diamond and cubic boron nitride. This ensures that the highest levels of accuracy are maintained during the grinding, lapping and polishing processes. Additionally, 450-CPZ is capable of handling wet grinding, making it suitable for use in a range of machining processes. MOORE 450-CPZ also benefits from advanced safety features, including non-contact sensors and automatic shutoff devices. This helps to prevent damage to the machine and the wafers in the event of a machine malfunction. Additionally, the machine is equipped with an intuitive user-friendly interface, making it easy to operate. 450-CPZ Wafer Grinding, Lapping & Polishing System is an ideal choice for any industrial application requiring grinding, lapping and polishing of wafers. With its high performance capabilities, precise CNC spindle and safe operation, MOORE 450-CPZ is an excellent choice for achieving sub-micron precision results.