Used NAGASE INTEGREX W-4 #170039 for sale

NAGASE INTEGREX W-4 is a fully-automated wafer grinding, lapping and polishing equipment. Designed with advanced machine functionality, it is capable of meeting ultra-high accuracy standards for uniformity, consistency and precision. The system starts with wafer loading on to an XY-motion stage. Once loading is complete, the wafers are automatically transported to the grinding stage. Here, an air bearing spindle offers Ultra-High speed rotation to achieve the desired high level finish at a low risk of particle generation. Grinding is controlled through monitoring of mainshaft rotational speed, position and down force. Once the grinding process is done, the wafers are transported through to the lapping stage where they are mounted. Here, a linear motion motion belt is used to drive the wafers and minimize particle emission. The lapping spindle is designed with an active vibration damping unit and precision servo motors on all axes, to provide the highest possible accuracy. Finally, the wafers are transported to the polishing stage. A ridged steel polishing disc is employed, which is dynamically balanced and has dynamic air thrusters to provide accuracy at the nanometer level. The polishing pressure can be precisely controlled to eliminate imperfections whilst controlling the finish. W-4 uses a roller ejection machine to eject the wafers and a single conveyor to move them through the rest of the process with utmost precision. In addition, the tool has both a cleanroom compatible design for suppressing particle generation and a safety asset for protecting both the equipment and humans from sudden damage. Overall, NAGASE INTEGREX W-4 is a high-performance model for wafer grinding, lapping, and polishing. It is designed to offer optimal speed and precision at a high level of efficiency, making it a popular choice in the semiconductor and medical device industry.