Used NOVELLUS / IPEC / WESTECH / SPEEDFAM 676 #9212984 for sale

NOVELLUS / IPEC / WESTECH / SPEEDFAM 676
ID: 9212984
CMP Polisher.
NOVELLUS / IPEC / WESTECH / SPEEDFAM 676 wafer grinding, lapping, and polishing equipment is a highly versatile and technologically advanced system for surface preparation in the semiconductor and electronics industries. It is a self-contained unit capable of grinding and polishing wafers up to 12-inch in diameter with a surface finish of Rmax/Rz ≤ 8.0µm on a range of application-specific wafers, such as PAD, ARX, and BOPP. The unit is capable of grinding, lapping, and polishing at speeds up to 150mm/sec and is highly recommended for use on 300mm wafers due to its high-performance capabilities and accuracy. IPEC 676 utilizes the latest in abrasive technology, offering numerous features and capabilities. It features a robust dual spindle design that allows for simultaneous grinding, lapping, and polishing of two wafers at once. A highly rigid XY stage ensures precise and accurate movements of the wafer, and a sensitive Z stage allows for finer surface planarization on a range of wafers. The grinding/lapping/polishing table is made from a BLC-40 epoxy resin base that is resistant to contamination and warping, and it also contains a patented straight edge holder machine that ensures equal grinding and polishing pressures across the entire wafer. The easy-to-use graphical user interface allows the operator to accurately program the machine and monitor the performance of the wafer. In addition to wafer grinding, lapping, and polishing, WESTECH 676 is capable of RIE, DRIE, and etching processes. It includes a full suite of safety features, such as an embedded acoustic monitor, anti-binding sensors, and dust management systems, to ensure the safety of both the operator and the wafer. The tool is also equipped with PC control capabilities that allow for a variety of functions, including monitoring operations, diagnostics, and documentation. SPEEDFAM 676 is a highly reliable and efficient asset that is ideal for a range of wafer surface preparation applications.
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