Used NTS NFL-4020 #9364616 for sale

NTS NFL-4020
ID: 9364616
Wafer Size: 2"-6"
Lapping machine, 2"-6".
NTS NFL-4020 is a wafer grinding, lapping, and polishing equipment designed to produce superior flat surfaces on semiconductor wafers. This machine offers high-precision and high-production throughput for maximum productivity and cost-effectiveness. The machine is powered by a high-precision motor control system that ensures precise control of the grinding, lapping, and polishing process. The motor is a state-of-the-art brushless type with digital encoders for precise speed and acceleration/deceleration control. This motor control unit is coupled with an advanced software program for machine setup and programming. The advanced software offers a variety of lapping and polishing strategies, and it can be used to optimize the process and achieve superior new levels of flatness and finish on the wafers. For grinding and lapping operations, the machine is equipped with a high-precision diamond-abrasive tooling machine to provide superior flatness on wafers with minimal damage of the wafer surface. The abrasive tooling tool is complemented by a high-efficiency vacuum asset to remove any off-cut material and dust particles. This helps to avoid undesirable contamination of the wafers. For polishing operations, the machine is equipped with integrated pressure and temperature control systems. This enables precise, even temperature control of the polishing process to ensure homogeneity of the surface. The machine also includes integrated optical sensors and cameras, so any non-conformities can be instantly identified and corrected. The machine is compact, transportable, and easy to use and maintain. A set of integrated gauging and quality control systems enable precision control throughout the wafer grinding and polishing process. The model can be remotely monitored and maintained, with notification of process alarm conditions and equipment messages. The user interface is intuitive and user-friendly, so a single operator can easily handle the entire grinding and polishing process. Overall, NFL-4020 is an ideal choice for grinding, lapping, and polishing applications that require superior flat surfaces on semiconductor wafers. It offers a reliable, precision-controlled process, advanced software features, and vibration-free operation, ensuring consistent high-quality results every time.
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