Used NTS NSC-4028 #9279239 for sale

ID: 9279239
Wafer Size: 6"
Vintage: 2013
CMP Polisher, 6" 2013 vintage.
NTS NSC-4028 is an advanced wafer grinding, lapping & polishing equipment specially designed for the production of highly precise, high-performance integrated circuit chips. In operation, it uses advanced mechanical and electrical techniques to quickly and accurately grind, lap and polish a variety of IC substrates. The system features a wide-area work table which is capable of grinding, lapping and polishing wafers that are up to 200 mm (7.87") in diameter. A side-mounted chuck is provided to load and unload wafers directly from cassettes, avoiding intricate manual handling. The wafer is then supported and secured on the table by an advanced vacuum hold-down unit, which ensures wafer stability for accurate results. A powerful DC brushless motor is used to drive an abrasive belt at variable speeds, enabling the precise grinding and polishing of a variety of semiconductor materials. Digital microprocessor technology has been incorporated into NSC-4028 machine to provide a range of user-friendly control functions. These facilitate accurate programming of grinding, lapping and polishing processes to achieve the desired material processing results. The particle suspension design of the tool ensures the safe and effective removal of grinding residue and residue slurry from the process. NTS NSC-4028's fully enclosed design helps to minimize any contamination of the process chamber and ensures a safe working environment. The asset's advanced alerting function warns of any operational faults, allowing corrective action to be taken in a timely manner. Optional software tools enable users to monitor the grinding operation from a remote location and to develop custom grinding programs to suit specific applications. In summary, NSC-4028 is a sophisticated and reliable solution for the production of high-performance integrated circuit chips. Its advanced capabilities ensure that high precision, repeatable grinding, lapping and polishing results can be achieved at an efficient rate.
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