Used OPTOTECH EasyTwin #293653099 for sale

ID: 293653099
Grinding machine.
OPTOTECH EasyTwin is a state-of-the-art wafer grinding, lapping & polishing equipment that offers a unique combination of high production throughput and process accuracy for various substrates including Silicon, Quartz and Sapphire. EasyTwin allows for tight control over process parameters and is suitable for various types of wafer shapes and sizes. Using OPTOTECH EasyTwin creates uniform grinding and polishing surfaces with minimal defects. The system is made up of a main frame and the easy to use graphical user interface (GUI) that allows for input of process parameters and a display of results. EasyTwin also offers multiple modes of operation ranging from manual to fully automatic. This makes it extremely versatile and capable of processing several types of substrates at the same time or in sequential order. OPTOTECH EasyTwin also features a modular design which allows users to configure the unit to meet their specific requirements. The machine uses an easy to operate multi-axis motion controller and drive tool with an In-Plane and Out-of-Plane control along with an anti-rejective error correction. This ensures that the process remains repeatable, reliable and accurate. EasyTwin also offers a servo controlled lapping head and a machine platform for high throughput. The lapping head can be tailored for various lapping/polishing processes depending on the substrate material being processed. OPTOTECH EasyTwin boasts a variety of process options including low and high-speed grinding, abrasive lapping and dry polishing. All of these processes can be easily fine-tuned, monitored and managed from the intuitive GUI. Additional categories of process options include cleaning, measurement, and testing. To ensure the highest level of accuracy, EasyTwin uses a patented closed-loop Image Recorder Asset (IMS) for lapping and polishing process monitoring and control. This flexible and reliable model is designed with safety in mind, featuring numerous sensors and built-in safety features. OPTOTECH EasyTwin also has automatic, remote, and manual modes of operation which allow users to monitor, operation and diagnose the equipment from remote locations. Overall, EasyTwin is a state-of-the-art wafer grinding, lapping & polishing system that provides a reliable, efficient and repeatable way to process various types of substrates. This complete unit offers superior process accuracy, flexibility and safety for a wide range of lapping and polishing applications.
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