Used PROTH SPGS-0060AH #9238695 for sale

PROTH SPGS-0060AH Wafer Grinding, Lapping & Polishing Equipment is a fully automated system designed to grind, lap and polish wafers to exacting standards. The unit can be used for production grinding, lapping and polishing operations as well as for R&D and lab applications. The machine features a high-precision turn table, a fully integrated software environment and a flexible design allowing easy upgradeability. The turn table is designed to rotate the wafer in high-precision and high-accuracy motion. This is done using a direct drive motor which offers very low rotation noise and minimal vibration. The table is capable of rotating up to 800 RPM with a maximum concentricity error of 2µm for the wafer. The tool uses a grinding, lapping and polishing media which is automatically dispensed and removed with a proprietary mechanism. The media is fully automated and can be changed quickly and easily. The media is usually diamond embedded in various grades of paper, foam, or rubber to facilitate different grinding, lapping and polishing processes. The control asset of SPGS-0060AH is highly advanced and allows precise and consistent grinding, lapping and polishing of wafers in a wide range of settings. The software is also flexible and allows users to customize the grinding, lapping and polishing processes to meet the need of their specific application. The model is also equipped with safety features which prevents the turn table from accidental turning on or off during operation. It also monitors the temperature to ensure the proper working environment is maintained and to avoid damaging the wafer due to overheating. PROTH SPGS-0060AH Wafer Grinding, Lapping & Polishing Equipment is suitable for use in industries such as semiconductor, sensor, and optical device fabrication. It provides a cost-effective solution for high-precision wafer fabrication processes while ensuring the safety and quality of the finished product.