Used SCHNEIDER CCP 102 #9287233 for sale

SCHNEIDER CCP 102 is a wafer grinding, lapping & polishing equipment specifically designed to process and produce semiconductor wafers for the consumer electronics industry. This system features a cutting-edge design, robust construction and software-controlled operation. CCP 102 can process wafers up to 8 inch in diameter, enabling the user to work with a wide variety of semiconductor wafers. The unit is equipped with a high-frequency controlled AC spindle motor for precise grinding, lapping and polishing. The two-stage wheel design provides high efficiency and minimal risk of dust accumulation. SCHNEIDER CCP 102 can grind and polish wafers to a range of thicknesses, making it ideal for a wide range of applications. For example, it is capable of grinding up to a thickness of 10 μm in a single pass. In addition, the machine is also equipped with a programmable surface control tool for accurate finishing and higher productivity. The asset is easy to set up and use, making it suitable for a range of operators. Furthermore, the cleanroom-friendly design ensures that the model can be used in a variety of environmental conditions with minimal risk of contamination. Beyond this, CCP 102 is also highly efficient and cost-effective. The user can expect reduced consumption and operation costs since it is equipped with a precision-engineered cooling equipment. Overall, SCHNEIDER CCP 102 is an advanced system that offers an unparalleled level of precision, efficiency and performance. It is designed to provide reliable and cost-effective results in a wide range of wafer processing applications.