Used SCHNEIDER CCP 103 #9359561 for sale

SCHNEIDER CCP 103 is a powerful wafer grinding, lapping and polishing equipment that delivers superior performance and accuracy. The system consists of a modular platform with three independent axes, the X-axis and Y-axis, and the Z-axis for mounting the wafer during operation. Its design enables the user to quickly change between grinding, lapping and polishing operations with minimal set-up time. CCP 103 has a unique mechanical Isotop drive unit which enables precise and accurate motion control of the three axes. The drive machine is supported by innovative joystick controllers and OLED graphic display technology. The Isotop drive tool ensures efficient and accurate movement of the wafer, while providing the user with precise control over the grinding, lapping and polishing processes. The asset is equipped with an enclosed, explosion-proof enclosure that provides a safe work environment. The enclosure is equipped with an oil mist sensor and a vacuum model to ensure a clean work environment. In addition, the enclosure also houses a thermal compensation equipment that allows the system to operate at a consistent temperature. The unit is powered by a fast-response servo motor machine and a high-performance DC motor. The motor tool drives a belt-driven spindle assembly which is able to achieve a variety of speed settings. The high-performance spindle is equipped with a motorized overload protection feature which prevents damage to components caused by excessive force. The asset is also equipped with a vacuum table for mounting wafers during grinding, lapping and polishing operations. The table is designed to ensure that the wafer is securely held in place and has minimal vibration due to the use of high-quality vibration damping materials and thickness gauges. SCHNEIDER CCP 103 also includes a cooling model which helps to maintain a consistent temperature during grinding, lapping and polishing. The equipment is also equipped with an integrated filter system which helps to maintain clean, dust-free environment within the unit. CCP 103 is a powerful wafer grinding, lapping and polishing machine that offers superior performance and accuracy. Its integrated features and innovations make it suitable for a wide range of wafer processing applications. This tool offers reliable and repeatable results as well as a safe and clean operation.