Used SEIKOH GIKEN HDA-600 #9314357 for sale

ID: 9314357
Polisher P/N: PG5X-490-00 No polishing head.
SEIKOH GIKEN HDA-600 is a high-end wafer grinding, lapping, and polishing equipment designed specifically for semiconductor production lines. This system is capable of producing the perfect flat surfaces required for waveguide wafers to function properly in a variety of high-end applications, such as in the telecommunications and medical sectors. Its features include a high-accuracy spindle with a high-speed drive unit, a user-friendly control panel, and a two-stage vibration-sensing machine that can detect potential irregularities while under operation. In addition, its advanced loading and unloading systems provide great flexibility and precision compared to other systems in its class. HDA-600 is capable of grinding, lapping and polishing single or multi-layer waves to precision accuracies as high as 0.5 nm (nanometer) or better. This tool can also accurately position the wafer within 0.4µm (micrometer) for its alignment to the output grinder. This precise accuracy is maintained regardless of whether the alignment is manual or robotic. The asset has a high-accuracy spindle which allows for the precise positioning of the grinding wheels on a precise surface. Thanks to the wide range of spindle speeds offered, SEIKOH GIKEN HDA-600 is also suitable for use in both hard and soft lapping operations. Its automatic spindle direction reversal feature ensures quick and precise grinding by reduction of the buildup of any material on the surface of the wafer. In addition, HDA-600 boasts powerful motors capable of generating up to two horsepower while operating with a noise level of less than 75 dB. This allows the model to perform all processes with minimal noise disturbance in the workspace. Additionally, the equipment is designed to be scalable, which means it can be integrated into existing semiconductor production lines with ease. Overall, SEIKOH GIKEN HDA-600 is a high-precision and reliable wafer grinding, lapping, and polishing system that is widely used for the production of waveguide wafers. Its flexible, user-friendly design and precise accuracy provide a reliable solution forsemiconductor production.
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