Used SPEEDFAM 12B-8L #9031665 for sale

SPEEDFAM 12B-8L wafer grinding, lapping and polishing equipment is a comprehensive system designed to help with wafer preparation needs in the semiconductor industry. It is designed for grinding, lapping and polishing single- or multiple-sided wafers, helping ensure the highest quality surface finish while maintaining tolerances and accuracy. It delivers superior precision while reducing cycle times and costs. The unit can grind, lap, and polish up to 12 different thin wafers (with a thickness range of 0.05 mm - 1.0 mm) in one cycle. It has both manual and automatic feed modes, which allows the operator to set the desired feed rate. In addition, it can handle both whole and partial wafers with a diameter ranging from 25.4 mm to 150 mm. The machine utilizes a vertical spindle grinding head, infrared sensor, abrasive brush, and diamond abrasives to achieve optimal grinding and polishing results. This tool has a low temperature of operation and a high rate of accuracy, allowing for shorter cycle times and higher yields. It features an eight (8) station lap disc changer, whereby diamond abrasives can be quickly changed out in between wafers, resulting in sharper, smooth wafer surfaces. The motorized adjustment of the infeed and outfeed spindles allows for higher throughput and better surface finishes. The built-in touchscreen controls enable quick setup and adjustments, making the operation of the asset straightforward. In addition, it has a coolant temperature control model, which maintains the equipment at optimal temperature for higher yields and improved surface finish. 12B-8L wafer grinding, lapping and polishing system can be used for a variety of semiconductor devices, including integrated circuits, memory chips, microprocessors, thin-film transistors, and more. It is the ideall choice for wafer preparation needs in the semiconductor industry, offering superior processing quality while keeping cycle times and costs low.