Used SPEEDFAM 16B-5SSG #293639480 for sale

ID: 293639480
Vintage: 1989
Double side polisher 1989 vintage.
SPEEDFAM 16B-5SSG is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to meet the demanding requirements of MEMS, semiconductor, and optoelectronics manufactures. 16B-5SSG features a modular low-height design, allowing access to the entire machine during set up and maintenance. The system includes an integrated electrical panel, energy efficient variable-frequency drive, and a precision digital controller. SPEEDFAM 16B-5SSG is equipped with an advanced fixed-plate grinding holder with state-of-the-art air bearing technology for superior flatness and grain retention. This unique feature permits the setup and operation of multi-tasking grinding, or finishing, operations at the same time on up to 5 wafers simultaneously. In addition to its advanced grinding technology, 16B-5SSG also features an integrated vacuum unit and a custom designed holder with an integrated heating element. With this machine, the temperature of the wafer can be accurately adjusted throughout the polishing process. This ensures consistent lapping and polishing with no thermal shock to the wafer. SPEEDFAM 16B-5SSG features a full complement of safety features including a safety interlock tool to prevent unauthorized access to the asset, electrostatic shielding to minimize EMI emissions, and an emergency stop switch to shut down the model if unanticipated hazards present themselves. 16B-5SSG has been designed to meet the most rigorous process requirements and comes equipped with precise control capabilities including precise adjustment of process parameters such as feed rate, grinder diameter, grinding pressure, spindle speed, and polishing speed. The equipment has been tested and validated by SPEEDFAM to ensure reliable and repeatable wafer grinding, lapping, and polishing. SPEEDFAM 16B-5SSG offers superior production rates with minimum waste and maximum operator safety. It is ideal for grinding, lapping and polishing semiconductor wafers, MEMS and optoelectronic components, and other intricate processes in the electronics and photonics industries.
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