Used SPITFIRE SP-888-36-DW #157626 for sale

ID: 157626
Vintage: 1981
Double-sided lapping machine, 36" Specifications: Lapping Plate Diameter (Top & Bottom): 36" Distance Between Top and Bottom Plates: 0" – 19.5" Top Grinding Plate Depth: 1/8" Bottom Grinding Plate Depth: 1/2" Distance Floor to Bottom Plate: 36" Lapping Plate Speeds (Variable): 15 – 45 RPM Lapping Ring Size: 8-5/8" ID x 12-1/2" OD Motor: 5 HP 3/60 Includes: 1-1/2" Thick Lapping Plate Coolant System Pushbutton Operator's Control Station (3) Conditioning Rings Automatic Timer Agitator Pump and Controls 1981 vintage.
SPITFIRE SP-888-36-DW from Dynamic Wafer Industries is a high-precision wafer grinding, lapping and polishing equipment designed for the most demanding and exacting semiconductor processing requirements. This machine features a fully automated two-stage grinding, lapping and polishing process that yields sub-micron abrasive particle and surface finish for extreme accuracy and repeatability. The system utilizes two 8-inch grinding wheels that are adjustable in speed and rotation direction, allowing the user to tailor processing conditions to any application. The grinding wheels, each with their own independent control, are capable of reaching speeds up to 20,000 RPM, providing real-time process precision and higher throughput rates than with manual processes. A dual grinding, lapping and polishing option can also be selected, allowing for the highest material removal rates. The machine also features a two-stage lapping unit with a dedicated lapping silicon carbide abrasive for higher precision lapping and greater accuracy. The lapping process gives a superior surface finish and a superior edge profile than the grinding process alone. SP-888-36-DW is equipped with an advanced polishing chamber that delivers precise, uniform results, via a controlled slurry flow, particle size and polishing pressure. The chamber is also capable of holding multiple wafers, depending on the model, allowing for higher process throughput. SPITFIRE SP-888-36-DW is equipped with an easy-to-use control interface to ensure simple operation and precise process parameters. It also allows the user to store, recall and refine process recipes with exacting accuracy. Additionally, the processing chamber can be easily unmounted for easy wafer loading, unloading, and maintenance. This machine is perfect for demanding wafer grinding, lapping and polishing applications, offering precise, repeatable, and highly accurate results. Its controls and chamber design also guarantee that all of the process parameters are always precise and reliable, ensuring consistent and precise product quality. This ensures that the results produced using SPITFIRE SP-888-76DW consistently meet the most exacting quality standards.
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