Used SPITFIRE SP-GYR-48PNLCCA #9386560 for sale

SPITFIRE SP-GYR-48PNLCCA is an advanced wafer grinding, lapping and polishing system designed for precision finishing of thin-film materials for high-performance electronics and MEMS applications. It features an automated full-size 48" x 48" working platform, full-sized ceramic mandrels and adjustable, programmable speed control. SP-GYR-48PNLCCA includes a closed-loop controller to maintain precise process conditions, and provides application-specific terrain control, adjustable gyratory speed, force, water levels and SPITFIRE Spin Process™ technology for a superior surface finish. It is capable of both single- and multi-axis grinding/lapping operations. SPITFIRE SP-GYR-48PNLCCA is equipped with an automated, computer-controlled grinding/lapping head which provides a highly repeatable finishing process. The machine head is connected to a powerful, high-torque motor that delivers precise grinding/lapping action to ensure a uniform finish. The motor is also encased by a stainless-steel housing to protect it from dust and debris. The advanced process control system of SP-GYR-48PNLCCA makes it ideal for thin-film polishing. This is made possible by the use of advanced software for process control and optimization, which makes it easy to achieve a uniform surface finish. The software also enables users to define process parameters and customize grinding and polishing operations to meet specific requirements. SPITFIRE SP-GYR-48PNLCCA is suitable for a wide range of wafer processing applications including wafer thin-film polishing, MEMS device fabrication, chamfering, mirror finishing and silicon-on-insulator wafer prepping. It is an ideal choice for users who require high precision and accuracy when finishing thin-film materials. The system is supplied with a range of consumables and accessories and is CE compliant.