Used STAHLI DLM 700-3 #9195339 for sale

STAHLI DLM 700-3 is an advanced wafer grinding, lapping, and polishing equipment, providing superior results and high accuracy processing. This versatile, dry process system enables simultaneous grinding, lapping, and polishing of multiple wafer types, ranging in thickness from 2 mm to 18 mm and in diameter from 150 mm to 300 mm, in a single setup. It consists of up to three independent, programmable grinding and polishing spindles, all integrated and driven by a single torque motor. DLM 700-3 is the only unit with complete control over the lapping and polishing process parameters, including advanced automation functions such as in-process sensing, feedback control for removal rate and surface finish, along with a wide selection of process recipes. For high throughput production, the machine is easily scalable for additional spindles for parallel processing. STAHLI DLM 700-3 provides superior removal accuracy as each wafer is automatically fed through the lapping and polishing spindles. The integrated vision and in-process metrology systems provide critical feedback to optimize lapping and polishing results. The use of these systems ensures that the tool works automatically and reliably to produce a superior surface finish and superior removal accuracy. Additionally, the product is designed with a standard process cassette, which allows for less set-up time and higher productivity. The SLM 700-3 asset is designed for the most demanding and difficult applications, enabling large-scale production at high speed and accuracy. This versatile and fully automated model integrates a selection of process tools, from standard lapping plates to advanced grinding wheels and diamond abrasives. Additionally, the equipment allows for the use of slurry distributors, enabling the precise control of a variety of process fluids. The system is also capable of maintaining a clean and safe environment while processing wafers, with built-in safety features including a dust extraction unit, ventilation and acoustic monitoring. Overall, DLM 700-3 is a powerful machine for precise and efficient processing of multiple types of wafers. It is designed to exceed the highest standards of accuracy and reliability, and provides an optimized platform for both high-volume production or research and development applications. STAHLI DLM 700-3 is the choice of many of the leading wafer manufacturers, offering the most versatility and flexibility to meet demanding application requirements.