Used TAMUKAI TLP-6B #9050600 for sale

TAMUKAI TLP-6B is a high-precision precision wafer grinding, lapping and polishing machine. It is designed for the production of extremely flat and homogenous surfaces on materials with different hardness and complex geometries. TLP-6B consists of a main body, a grinding wheel head, an upper lapping plate and a lower lapping plate. The machine is equipped with a high-accuracy, five-axis motion control equipment that enables precise operation and monitoring. The grinding wheel head is adjustable in height and can be rotated up to ±45°. The lapping plates feature adjustable couplings that allow them to be adjusted in radial and angular direction. The lapping plates are driven by direct-drive motors and can run at speeds up to 15m/s, for a higher level of lapping accuracy. TAMUKAI TLP-6B is designed to accommodate wafers ranging in size from 60mm to 300mm in diameter. The unit features a rotate-able loading and unloading station that allows it to handle wafers in any orientation or as individual pieces. Additionally, the machine is equipped with an automated cleaning system that applies liquid cleaning solvents to remove surface contaminants from the wafers. TLP-6B also includes a CCD camera that is integrated with the machine's software unit to allow for real-time monitoring of the wafer surface and the grinding, lapping and polishing process. The machine is also equipped with a touch-screen display that allows users to quickly set parameters or manually adjust the motion of the machine. Finally, TAMUKAI TLP-6B is compatible with advanced measuring instruments to ensure a high level of quality control. For instance, the unit is equipped with a laser interferometer to provide an accurate profile of the wafer surface. Additionally, TLP-6B is equipped with a rotation tester to detect flatness and run-out errors. In sum, TAMUKAI TLP-6B is an advanced wafer grinding, lapping and polishing machine capable of handling a variety of materials, wafer sizes and measuring instruments. The machine includes a five-axis motion control tool, CCD camera, automated cleaning asset, and a rotatable loading and unloading station for efficient wafer handling, as well as supporting advanced measuring instruments. This makes TLP-6B an ideal choice for achieving extremely flat and homogenous wafer surfaces.