Used TOKYO SEIMITSU PG 200RM #9159960 for sale

ID: 9159960
Vintage: 2005
Back grinding system 2005 vintage.
TOKYO SEIMITSU PG 200RM Wafer Grinding, Lapping & Polishing Equipment is a highly efficient tool for processing a wide range of semiconductor wafer materials. This system is designed to provide optimal grinding and polishing results for every wafer size, from as small as 200mm up to 8" in diameter. PG 200RM features a powerful wafer grind spindle, two precision stationary grinding wheels, two precision lapping and polishing wheels, a diamond-embedded paper pad, and a dust collector. TOKYO SEIMITSU PG 200RM is capable of achieving a finish of Ra 0.3μm on most materials with a few passes, making the process more efficient and gentle on the wafer surface. The grind spindle unit is of a multi-pass drives unit, driven by a highly reliable and high-torque direct current motor. This motor is also equipped with speed and current monitoring features. PG 200RM is designed to offer excellent results at higher speeds, resulting in a high throughput without compromising on quality. Additionally, the grind spindle unit machine is protected by a dedicated safety cover. TOKYO SEIMITSU PG 200RM tool is equipped with two precision stationary grinding wheels for fine grinding and surface smoothing. The wheels are wheel-type adjustable, with two grindable faces capable of dealing with surfaces with different levels of roughness. The two precision lapping and polishing wheels feature an exceptionally hard and durable surface for exceptional finish results. The asset is ideally suited for silicon, sapphire and quartz applications. PG 200RM is also designed to provide superior uniformity of the wafer polishing results. The diamond-embedded paper pad is designed to provide a more consistent finish across the wafer. Finally, a powerful dust collector ensures the workplace is kept clean and tidy. TOKYO SEIMITSU PG 200RM Wafer Grinding, Lapping & Polishing Model proves to be a versatile tool that can be programmed to perform grinding, lapping and polishing operations on a wide range of materials. This equipment is designed to be reliable and efficient, offering high throughput levels and a superior finish quality. Its dust collection and protection features provide a safe and clean working environment.
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