Used TOKYO SEIMITSU PG 200RM #9217398 for sale

TOKYO SEIMITSU PG 200RM
ID: 9217398
Vintage: 2005
Back grinding system 2005 vintage.
TOKYO SEIMITSU PG 200RM is a sophisticated wafer grinding, lapping and polishing equipment designed to provide precision surface finish on semiconductor wafers. This precision wafer grinder offers the ultimate in control and precision processing for high-value LED, optical and semi-conductor applications. PG 200RM features a high-speed, hard-coated, rigid spindle that is designed for precision grinding and lapping applications. The system is equipped with a fully automated, programmable grinding wheel that can be operated in both manual and automatic modes. It offers an adjustable depth of cut range from 0.2 micron to 5 microns and can accommodate wafers from 25mm to 200mm in diameter. TOKYO SEIMITSU PG 200RM is designed to ensure consistent, high quality results with a simple, user friendly operating unit. The machine incorporates a number of fully regulated safety features and is capable of processing wafers at high rotational speeds and feed rates with precision. The tool includes advanced signal processing technology to identify overcrowding on the grinding surface, and an advanced motion control asset to precisely control the spindle speed and the feed rate of the material. PG 200RM is ideal for use in photonics and Semiconductor industries, due to the high precision surface finish it can provide. The model is equipped with integrated optics to systematically measure the wafer surface and to ensure a uniform and consistent finish. The equipment is also equipped with a diamond conditioning arm designed to provide repeatable, high-polish surface finish. In addition, TOKYO SEIMITSU PG 200RM features an automatic, cycle-controlled cleaning system that helps to ensure that the wafer surface remains free from particles and damage. The unit also includes a user-friendly software package, which helps to monitor the lapping and grinding performance and to maximize the efficiency of the wafer preparation process. PG 200RM requires very little maintenance, and its small footprint allows easy integration into existing processes. This machine is an ideal choice for applications that require a high degree of precision and accuracy. The high-end engineering and technology used in TOKYO SEIMITSU PG 200RM makes it an excellent choice for manufacturers seeking to achieve a superior surface finish on semiconductor wafers.
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