Used WENDT WAC 715 #9385702 for sale

WENDT WAC 715 is a precision wafer grinding, lapping and polishing equipment designed for large scale production of high value, high quality semiconductor wafers. It combines the precision grinding, lapping and polishing of wafer surfaces to achieve ultimate flatness, defect free surfaces, and high uniformity parameters for demanding semiconductor device fabrication applications. The system is designed for 24/7 operation and includes a high-pressure reciprocating grinding/lapping head, an eight-station rotation polishing machine, and humidity-controlled wafer handling/inspection chambers. The grinding head on WAC 715 is adjustable in stroke, pressure, speed and feedrate, enabling a variety of different grinding projects to be undertaken. The device features a diamond abrasive pad for wafer surface grinding, and a polishing pad for precise polishing of the wafer's edge, allowing for detailed and accurate profiling of the wafer. The flexible design also enables quick and easy loading and unloading of wafers, allowing for fast turnaround times between grinding processes. WENDT WAC 715's eight-station polishing machine allows for an effective and efficient polishing process. The device uses a combination of scuffing and polishing media, which is mapped to a specific number of programming presets and tailored to the specific requirements of each wafer. The polishing machine is also used to achieve a low defect count, improve quality, and eliminate undesired contamination while providing uniformity parameters above industry standards. WAC 715 also features a humidity-controlled station to protect sensitive wafers during cleanroom operations. The station ensures that wafer handling and inspection processes are free of dust and contaminants, while also preventing the formation of condensation. The humidity chamber can also be used to store wafers in prior to loading them into the unit. WENDT WAC 715 machine is designed for high performance, cost-effective semiconductor wafer processing. It offers optimum repeatability and accuracy for winding, grinding, lapping and polishing operations, in addition to high yields and strict quality control standards for manufacturers of today's most advanced semiconductor devices.