Used WINSLOMATIC 400 #9001192 for sale

WINSLOMATIC 400 wafer grinding, lapping and polishing equipment is a precise, cost-effective solution ideal for producing high-quality wafers in a wide range of sizes and shapes. The system has been designed to provide an efficient workflow while eliminating many of the costly and time-consuming steps associated with traditional grinding and polishing techniques. 400 unit consists of a mainframe with four different mechanical parts: a grinder, a lapper, a polisher, and a deburring machine. The grinder removes the bulk of the material using abrasive grinding wheels of various sizes, depending on the material and size of wafer being produced. The lapper utilizes resin-bond diamond surfaces and cushions to precisely lap and flatten the wafer. The polisher uses a combination of pads and micro-abrasives to refine the finish, increasing the surface smoothness and accuracy of the wafer. The deburring machine uses lighter abrasives to finish the wafer, resulting in an ultra smooth surface. The machine can accommodate wafers up to 300mm in diameter. The integrated automatic loader allows for quick and easy set up and loading of wafers. An intuitive control panel is included, which provides access to a wide range of digital parameters, controlling cycle time, pressure, and flow rate. A series of sensors and reading devices monitor the progress of each wafer and notify operators when wafers are ready for unloading. WINSLOMATIC 400 incorporates safety features including an integrated laser interlock device, which prevents the grinder from spinning when the operator is present, as well as emergency stop buttons for quick and easy shutdown. In addition, the tool is engineered to provide smooth and efficient operation, with minimal downtime and maintenance costs. 400 has been designed to provide a reliable and repeatable solution for producing high-quality wafers. The wafers produced with this asset are typically used in a variety of applications such as medical devices, LED displays, and other electronic components.