Used KAWASAKI 3NX520B-A007 #9030739 for sale

KAWASAKI 3NX520B-A007 is a wafer handling industrial robot specifically designed for semiconductor packaging and related processes. It is a reliable and durable robotic solution for wafer handling applications in a variety of industries, including semiconductor, automotive, aerospace, and medical device manufacturing. 3NX520B-A007 features a four-axis articulated arm designed for precise and efficient wafer handling. It features a collection of high-precision rotary encoders, three-stage harmonic drivers with 1/4-inch accuracy, and anti-backlash gearboxes for optimized operation and accurate positioning. Additionally, the robot also features a synchronizable 6-axis motion platform for flexible, real-time, and coherent multi-axis operations. KAWASAKI 3NX520B-A007 has an advanced and intuitive user interface, which allows users to program and control the robot's movements quickly and easily. The robot's remote control panel, which is accessible via a web or a mobile device, allows users to monitor the robot's activities in real time. The robot also features a programmable language, which allows users to write custom functions to control and automate the robot. 3NX520B-A007 is a lightweight, compact, and versatile wafer handling robot, which can be used in a variety of applications. It is designed with heavy-duty industrial grade materials to handle continuous operations. The robot is also equipped with cutting edge safety features, such as elastomeric bumpers and built-in safety protection systems, to ensure the safety of its operators and the integrity of the wafers. KAWASAKI 3NX520B-A007 is also equipped with a library of preset operation programs to improve the reliability and accuracy of its movements. These preset fabrication programs can easily be modified and customized in order to match the requirements of the users. In conclusion, 3NX520B-A007 is an advanced, reliable, and versatile wafer handling robot for a variety of industries. Its advanced technologies and features, such as its user friendly interface, six-axis motion platform, precise encoders, and safety features, enable it to provide an efficient and reliable way of handling wafers at high speeds.