Used FEI DA300 #9266820 for sale

FEI DA300 is a revolutionary wafer testing and metrology equipment designed to meet the demands of advanced technology node processing and yield management. Developed by FEI Company, DA300 is a unified metrology platform that combines multiple metrology solutions in one system. This allows users to have maximum flexibility in scaling from individual wafer solutions to high volume production wafer probing. FEI DA300 unit offers high throughput and uncompromised accuracy for inspecting and verifying the performance of input, incoming and output wafers and devices. Its advanced metrology capabilities come from the combination of FEI advanced optical inspection and various characterization solutions. The optical inspection provides sub-micron resolution images of surface, electrical and process-related measurements, while the various characterization solutions offer complete characterization of resistance and capacitance, leakage current and dielectric constant. The machine is also capable of high speed, single die probing. The cutting-edge mechanical design of DA300 platform is optimized to reduce cycle-time and increase throughput, while maintaining tight control of probing force to minimize the impact on device performance. Innovative AutoFocus technology utilizes differential optics to facilitate fast and consistent focusing of the probe head, resulting in a significant reduction in total setup time. To enable fast and easy hardware and software control, FEI DA300 is outfitted with an automated robotic arm. This robot arm is computer controlled and provides fast and flexible movement, as well as wafer gripping and probing force control. The tool can be further customized using optional add-on modules, such as SEM/FIB, Raman and High-Resolution Critical Dimensions Measurement (HR-CDM). Complete integration with FEI software suite makes DA300 an ideal solution for complete metrology needs. FEI DA300 offers superior performance and accuracy without compromising flexibility or longevity. Its flexible configuration provides maximum design freedom and the ability to easily adapt to changing product requirements. The platform's robust design and innovative features allow the asset to handle any wafer application, ensuring reliable and repeatable results.