Configuration
auto loadlock ion mill, 4” square substrates, anisotropic, high yield etching of any material including Au, Cu, Ni, Cr, and TiW. Multistep etch processes for stacked layers (MLC, MCM), ceramics, hybrids, thin film heads, flat panel displays, and high frequency devices. Substrate capacity up to 8" x 8" and 10" diameter. Weights to 5 pounds. Process flexibility includes IBE, RIBE, CAIBE, Patented "Flowcool" substrate cooling system with failsafe sensing
Here is a list of the new spare parts for the Veeco LL-250
1 Magnetic sensor
Shutter Gear Assembly
Shutter Worm Gear
Moly Screws for Source
Tungsten Source Wire
Tungsten Neutralizer Wire
Assorted Insulators
Assorted O-Rings
PC Computer:
Comark
Model: 4000 Series
Intel 486i
Rotation and tilting options configured
System used to mill: Platinum, Titanium, Nickel, Copper and Nichrome thin film metals
We also have the used parts (4 inch fixturing plates) that have been replaced in the machine
Operational
Can inspect
1994 vintage.