Bonders: MUHLBAUER DB 200 WTX-7

ID#: 9171579 Manufacturer: MUHLBAUER Model: DB 200 WTX-7 Category: Bonders Wafer Size: 6"-8" Equipment Details: Bonder, 6"-8"
Material handling capability:
Size: 0.3 x 0.3 mm ÷ 3.64 x 1.5 mm
Thickness: 270 ÷ 1000 μm

Lead frame:
Material: CUZN10
Width: 35 mm
Thickness: 0.38 mm

Adhesive:
Silver epoxy in 5 ccm and 10 ccm syringe

Wafer expander:
Rotation: 360°

Ejector:
Setting range:
x,y: 5 mm
z: 0.1 - 1.5 mm (pickup)

Epoxy system:
(1) Needle, time pressure dosing system
Correction of X,Y position as bond head

Lead frame transport:
Ongoing system reel to reel

Bond head:
Programmable x-y-z table with optical positioning / Pattern recognition system

Resolution:
X,Y,Z: 2 μm

Bonding range:
x: 5 mm
y,z: 50 mm
Pick / Bond force: 50 - 250 g (programmable).
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