Used ADT / K&S 4123 #9124878 for sale

ADT / K&S 4123 Bonder is an adhesive bonding instrument designed to join two dissimilar substrates together. This bonder utilizes a variety of different adhesive methods to provide superior joining strength. An enclosed bonding chamber provides automatic heat control and eliminates potential fire hazards. ADT 4123 utilizes pressure and time controls for accuracy and repeatability when bonding. The bonding power of this instrument is further enhanced by the inclusion of a digitally controlled ultrasonic transducer which creates a vibrating action that increases the bond strength of the adhesive to the substrate. K&S 4123 utilizes a pneumatically powered system to securely and instantaneously bond substrates together. This system uses high pressure air to maintain consistent pressure on the substrates until the bond is complete. This air pressure is adjustable to ensure the optimal pressure is achieved for the specific substrate materials being used. 4123 is designed to provide the highest quality of bonding available. It utilizes vacuum levels ranging from 0 to 150 in.Hg to ensure the highest strength bonds available. This vacuum level is adjustable to accommodate specific substrates that may require higher or lower pressure. ADT / K&S 4123 is equipped with precise time and temperature control to achieve the best adhesive bond for a variety of substrates. The temperature range for the bonded interface may be set between 0 degrees Fahrenheit and 300 degrees Fahrenheit. This temperature range can be adjusted in increments of 1 degree Fahrenheit to ensure accuracy in the heated bond. To further increase accuracy, the holding time can optionally be set to 0.01 seconds for substrates that require quicker bonding. ADT 4123 Bonder is specifically designed for high performance industrial setting to securely bond substrates. The incorporation of a high pressure system, adjustable vacuum level, and precise time and temperature control allows this instrument to deliver exceptional joining strength for many substrates. This bonder is a reliable and efficient choice for industrial adhesive bonding applications.