Used ALPHASEM AG DB608-L #9094428 for sale

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Manufacturer
ALPHASEM
Model
AG DB608-L
ID: 9094428
Bonder.
ALPHASEM AG DB608-L is a bonder from ALPHASEM AG designed for high-volume, automated production. The machine utilizes a thermal chuck to heat the substrates which are held in place using vacuum technology. The chuck allows for a quick and uniform heating of substrates with a heating time of less than 5 seconds. The solder joints are formed during the bonding process, with a bonder accuracy of ±2µm. The DB608-L has a glove box design that protects the components from particulate contaminants. The bonder features a dual-reach design with linear motion mechanisms on all 4 axes. This allows the bonder to access hidden joints and perform precise multi-point placement. It also has a high resolution vision equipment which detects and compensates for thermal expansion, ensuring accurate bond placement. The system also utilizes a permanent heaters and PID temperature control to maintain precise thermal cycles. The bonder is built with modular components that can be quickly changed, allowing for easy force calibration and maintenance. The unit has a 600W heat source and a power supply of 24V, allowing for a high speed heating cycle. The machine has a throughput of up to 1000 bonds/minute and is designed for high-throughput production. It also features a closed-loop control machine, which monitors and adjusts parameters for optimal performance. AG DB608-L is a high-performance bonder that is well-suited for both high-volume production environments and smaller production facilities. The machine utilizes advanced bonding technology as its heated chuck ensures a uniform and fast substrate heating. It also features a vision tool that ensures accurate bond placement, a PID temperature control that maintains precise thermal cycles and a dual-reach design that allows for precise multi-point placement. Furthermore, the machine is easy to maintain and calibrate, and has a throughput of up to 1000 bonds/minute.
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