Used ASM Eagle 60-03 #9201001 for sale

ASM Eagle 60-03
Manufacturer
ASM
Model
Eagle 60-03
ID: 9201001
Wire bonder.
ASM Eagle 60-03 is an ultra-precise bonder intended for use in a wide variety of semiconductor and electronics assembly operations. This bonder features a patented five-axis alignment equipment that allows it to accurately and quickly place parts and components on the PCB. It is equipped with a unique bonding tool that delivers an overall high degree of precision and reduces the risk of human error. This state-of-the-art bonder is capable of high-throughput, high-accuracy, and low-cost operation, making it ideal for use in high-volume production tasks. The bonder has a powerful motor drive and a servo control system that ensures smooth and precise movement of the bonder when placing components on the PCB. It is also equipped with high-resolution CCD cameras and a laser vision unit that enables precise alignment and accurate placement of components, even on complex single- and double-sided boards. To further enhance accuracy and repeatability, the bonder can be calibrated and adjusted according to the exact requirements of each job. Eagle 60-03 bonder also offers flexible programmability capabilities, with several programming modes that allow the user to customize the bonder operation to their specific requirements. It also has a highly advanced user interface that includes a touch-screen display, digital input and output ports, and a PC-based control machine. All these features allow the user to set up, monitor, and modify the bonder settings quickly and easily. Furthermore, ASM Eagle 60-03 bonder features a number of safety and reliability features, such as overload protection, current overload protection, power overload protection, and a dust-proof enclosure. These features ensure the safe, reliable, and efficient operation of the bonder. In conclusion, Eagle 60-03 is a state-of-the-art, high precision bonder that offers unparalleled accuracy, programmability, and safety features. It is ideal for use in a wide range of semiconductor and electronics assembly operations, and its outstanding performance guarantees reliable results.
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