Used ASM Eagle 60 #135194 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
Sold
ID: 135194
Wire bonders with vertical LED
Specifications:
Bonding system:
Bonding method: thermosonic (TS)
BQM mode: constant current, voltage, power and normal (programmable)
Loop type: normal, low, square, penta, J, VLED, FLEX
XY resolution: 0.2µm
Z resolution (capillary traveling motion): 0.4µm
Fine pitch capability: 35µm pitch at 0.6 mil wire
No. of bonding wires: up to 3000
Program storage: 1000 programs on hard disk
Multimode transducer system: programmable profile, control and vibration modes
Vision system:
Pattern recognition time: 60 ms/point
Pattern recognition accuracy: ± 0.37µm
Lead locator detection: 12 ms/lead (3 leads/frame)
Lead locator accuracy: ± 2.4 µm
Post bond inspection: first bond, second bond and wire tracing
Maximum die level different: 400 to 500µm
Material handling system:
Indexing speed: 200 to 250ms at 0.5" pitch
Indexer resolution: 1µm
Lead frame position accuracy: ± 2 mil
Applicable lead frame:
W:
24 to 73mm at bonding area in Y = 65mm
24 to 90mm at bonding area in Y = 48mm
L: 280mm (magazine)
T: 0.075 to 0.8mm
Applicable magazine:
W: 98mm (maximum)
L: 140 to 280mm
H: 180mm (magazine)
Magazine pitch: 2.4 to 10mm (0.09" to 0.39")
Device changeover: < 4 minutes
Package changeover: < 5 minutes
Number of buffer magazines: 3 (maximum 435mm)
Does not include a Cu kit for Cu wire bonding
2002 to 2005 vintage.
ASM Eagle 60 is an automated capillary bonder for submicron wire bonding. It features small and reliable components powered by a microprocessor that enables accurate function control. Its custom design combines a number of modular aspects that allow integrated upgrades and simplifies maintenance. Eagle 60 is equipped with a multi-zone heated stage that ensures process control, a user-friendly interface with adjustable precision thresholds and a highly sensitive micrometer. It also has a vision system that inspects each soldered joint and automatically records bonding activities. Bonding activities are performed with a heated capillary and an ultrasonic-tip whose distance calibration is adjustable. This ensures excellent control over the bonding parameters and enables the wiring of submicron components. The bonder is also equipped with a mounting head and two control arms that can be connected to an add-on structure for a more stable and reliable configuration. In addition, it features an integrated autocalibration system that streamlines repeatable bonding processes. Moreover, ASM Eagle 60 offers an advanced real-time programmable foil control system that supports an automated process development and control. For factors including cost, whole-life value, and ease of use, Eagle 60 is an excellent choice of bonder. It is extremely reliable, efficient and requires minimal operator intervention, making it ideal for a range of industrial and academic applications. Furthermore, its customizable design makes it an attractive option for those requiring an increased level of performance.
There are no reviews yet