Used ASM Eagle 60 #135194 for sale

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Manufacturer
ASM
Model
Eagle 60
ID: 135194
Wire bonders with vertical LED Specifications: Bonding system: Bonding method: thermosonic (TS) BQM mode: constant current, voltage, power and normal (programmable) Loop type: normal, low, square, penta, J, VLED, FLEX XY resolution: 0.2µm Z resolution (capillary traveling motion): 0.4µm Fine pitch capability: 35µm pitch at 0.6 mil wire No. of bonding wires: up to 3000 Program storage: 1000 programs on hard disk Multimode transducer system: programmable profile, control and vibration modes Vision system: Pattern recognition time: 60 ms/point Pattern recognition accuracy: ± 0.37µm Lead locator detection: 12 ms/lead (3 leads/frame) Lead locator accuracy: ± 2.4 µm Post bond inspection: first bond, second bond and wire tracing Maximum die level different: 400 to 500µm Material handling system: Indexing speed: 200 to 250ms at 0.5" pitch Indexer resolution: 1µm Lead frame position accuracy: ± 2 mil Applicable lead frame: W: 24 to 73mm at bonding area in Y = 65mm 24 to 90mm at bonding area in Y = 48mm L: 280mm (magazine) T: 0.075 to 0.8mm Applicable magazine: W: 98mm (maximum) L: 140 to 280mm H: 180mm (magazine) Magazine pitch: 2.4 to 10mm (0.09" to 0.39") Device changeover: < 4 minutes Package changeover: < 5 minutes Number of buffer magazines: 3 (maximum 435mm) Does not include a Cu kit for Cu wire bonding 2002 to 2005 vintage.
ASM Eagle 60 is an automated capillary bonder for submicron wire bonding. It features small and reliable components powered by a microprocessor that enables accurate function control. Its custom design combines a number of modular aspects that allow integrated upgrades and simplifies maintenance. Eagle 60 is equipped with a multi-zone heated stage that ensures process control, a user-friendly interface with adjustable precision thresholds and a highly sensitive micrometer. It also has a vision system that inspects each soldered joint and automatically records bonding activities. Bonding activities are performed with a heated capillary and an ultrasonic-tip whose distance calibration is adjustable. This ensures excellent control over the bonding parameters and enables the wiring of submicron components. The bonder is also equipped with a mounting head and two control arms that can be connected to an add-on structure for a more stable and reliable configuration. In addition, it features an integrated autocalibration system that streamlines repeatable bonding processes. Moreover, ASM Eagle 60 offers an advanced real-time programmable foil control system that supports an automated process development and control. For factors including cost, whole-life value, and ease of use, Eagle 60 is an excellent choice of bonder. It is extremely reliable, efficient and requires minimal operator intervention, making it ideal for a range of industrial and academic applications. Furthermore, its customizable design makes it an attractive option for those requiring an increased level of performance.
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