Used ESEC 3100 Optima P3 #9121233 for sale

Manufacturer
ESEC
Model
3100 Optima P3
ID: 9121233
Wire bonders.
ESEC 3100 Optima P3 is a precision bonder designed for semiconductor and substrate assembly. This bonder is equipped with a wide range of features which enable it to bond a variety of materials and substrates with reliable, repeatable performance. Its multimode capabilities allow it to be used for gold ball bonds, wire bonds, reflow and laminate processes. Its high-performance X-Y scanning system provides fast bond speeds and precise positioning to enable bond and substrate assembly with top accuracy. 3100 Optima P3 is capable of bonding a wide range of materials, including gold, aluminum, platinum, and silver. Its proprietary process enables the bonder to perform repeatable and reliable bonds with minimal contamination. The process is designed to minimize thermal loading, stress, and deformation of the material during the bonding process. The P3 bonder has an integrated background image system that enables it to monitor the substrate material during the bond process to ensure quality and reliability. The P3 bonder has been designed to be user-friendly and is equipped with a variety of intuitive tools for facilitating and honing the bonding process. It features an easy-to-use touchscreen interface with a comprehensive library of pre-programmed and user-defined recipes. Additionally, its versatile platform provides the ability to customize various bond parameters including speed, current, contact force and temperature. The robust construction of the P3 bonder enables it to deliver high-precision assembly and processing. Its unique Active Stabilization System (ASS) helps keep the bonder stable during high-precision assembly and processing while being resistant to environmental conditions such as vibration and heat. The P3 bonder also features an adjustable workstage, which allows it to adapt to various substrate sizes and processes. Overall, ESEC 3100 Optima P3 is a flexible and reliable bonder designed to bond a variety of materials with precision and accuracy. Its intuitive user-interface and wide range of features make it a great choice for semiconductor and substrate assembly.
There are no reviews yet