Used ESEC 3100 Optima P4 #9121219 for sale

Manufacturer
ESEC
Model
3100 Optima P4
ID: 9121219
Vintage: 2007
Wire bonders Ball bumping 2007 vintage.
ESEC 3100 Optima P4 is a high-performance, fully automated wire bonder specifically designed for working with specially coated, ultra-fine bond wires. Its unique design achieves maximum speed and accuracy with all types of standard and special-application bond wires, including Au, Al, Cu, Pt, Ag, and more. The Optima P4 is suited for a wide range of applications, including die-attach bonding, packaging, module assembly, and grounding and interconnecting. It is capable of bonding several types of substrates (such as aluminum, copper, glass, etc.) and can be used on a variety of substrates sizes. The machine also features a programmable temperature control system for fine-tuning the wire forming process and bonding parameters. The Optima P4 utilizes a unique dual-function bonding head design that provides enhanced accuracy for ultra-fine bond wires. An advanced, high-resolution imaging system allows the user to accurately monitor the bond to ensure optimal results under different process conditions. The machine also includes a built-in vision system for quick, hassle-free positioning and alignment. The Optima P4 comes with a range of sophisticated features, including touch-screen controls, a high-precision peristaltic pump, a laser power meter, and a reliable integrated semi-conductor heater. It also features an adjustable looping program, which allows the user to dial in specific looping parameters for the type of bond wire being used, reducing the need to adjust tooling and settings. The machine also offers preprogrammed memory parameters and a built-in simulation mode with real-time data display for prompt troubleshooting. In addition, the Optima P4 includes a state-of-the-art wire tensioner that provides consistent loop quality, reduces cycle time, and optimizes the thermal profile of the bond. For user convenience, the machine also includes a flexible data storage options, a differential generator chip, and a USB port for software updates and communication with other devices. Overall, 3100 Optima P4 is an advanced, cost-effective bonder that is ideal for high-volume production runs of ultra-fine wire bonds. It is ideal for users looking for superior speed, accuracy, and maximum control and flexibility. The machine's flexible programming and built-in support features support multiple applications and make it easy to adapt to changing requirements and process environments.
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