Used ESEC 3100 Plus #9095164 for sale

ESEC 3100 Plus is an automated wire bonder equipment designed for the manufacture of complex wires and electrical components. It is a state-of-the-art tool that enables the customer to meet the demanding needs of high precision and high performance for applications in a wide variety of industries. 3100 Plus is suitable for use in the automotive, medical, electronics, and aerospace industries as it provides high quality wires with homogenous encapsulation. This automated wire bonder is designed to be the most user-friendly on the market and can be operated with minimal operator intervention. With easy setup and programming, the machine allows a fast set-up time and its simple design ensures versatility, reliability, and safety. The wire bonder features a ball bonder, wedge bonder, and an advanced chip bonder, as well as an advanced single and double-sided vision system. The ball bonder can be used to bond wires with bond heights up to 20 mils. The wedge bonder offers superior accuracy and can be used to bond wires with bond heights up to 50 mils. The advanced chip bonder allows for the bonding of complex wires with very tight tolerance and accuracy. The single and double-sided vision systems provide excellent vision for pinpoint accurate seam and width measurement. ESEC 3100 Plus also offers high throughput for maximum efficiency. The machine can bond up to 1060 wires/minute at wire pitch of 200 um and a standard pitch of 150 um. It includes a built-in Insulation Thickness (IT) pre-set feature, which helps to reduce bond lengths by detecting and adjusting parameters for thicker wire insulation thickness. Additionally, the wire bonder has an auto-loading platform, which allows operator to quickly load parts without manually entering parameters. This bonder features an easy-to-use controller, which provides users with the ultimate user-friendly experience. It also offers multiple devices for monitoring and debugging wires, such as a real-time statistic function, test mode, and production data display. With a high level of versatility, 3100 Plus can be used in almost any application, from assembly line production to low volume prototyping and development. Overall, ESEC 3100 Plus is a reliable and versatile automated wire bonder equipment that offers precision and quality performance for various industries. Its ease of use and high-speed capabilities provide quick changeovers for superior productivity and fast wire bonds.