Used ESEC 3100 #9095156 for sale

ESEC 3100 is an automated high-performance die attach bonder engineered for high-volume production. It is capable of bonding a range of chip sizes ranging from 0.3mm to 5mm while still achieving Ultra High Accuracy and High Temperatures. It is well suited to meet the demand for high-volume SMT assembly and pad technology. The bonder boasts excellent repeatability with a placement accuracy of ±1µm at a temperature of +25°C, and ±0.5µm for a temperature up to +35°C. It is user-friendly, with a user-friendly graphical user interface, offering simplified programming and visualization of data. 3100 enables production of high-volume parts up to 2A of power draw per point, and its innovative cooling heads provide a homogeneous temperature in order to limit heat build-up, allowing for greater current mass flows across multiple points. A feature such as auto-scatteroff make it possible for the machine to automatically detect and terminate fuse-bonding paths. In addition, ESEC 3100 is equipped with vision alignment, allowing for accurate realignment of different die sizes and positions. It also can detect short-circuits, open-circuits, misconnections and so on, offering full traceability according to IPC and JEDEC standards. It is suitable for use in a variety of industries, and is constructed with a robust design to ensure its longevity in production environments. With the high accuracy, reliability and reduced power consumption, it delivers high yields and greater throughput while minimizing your costs.