Used ESEC 3100 #9154017 for sale

ESEC 3100 is a bonder from Universal Instruments Corporation that is used in the assembly of electronic components. It is specifically designed for flex and rigid-flex bonding and employs a hot-bar technology that enables the adhesion of various substrates. Through heat and pressure it ensures a strong and reliable bond even for thinner materials that require a higher thermal transfer. 3100 is equipped with a power module installed at the top which can reach temperatures of up to 380 °C, and includes a roller set for pressure control. It also features an intelligent vision equipment that automatically calibrates the tool, controls the temperature and rides the bond seam with precision to ensure the perfect bond. The bonder can take boards up to 22 x 22 cm in size and has a frequency response of 10 to 300kHz. It comes with three elements for the heating method with USB interface for controlling parameters. The user settings can easily be transferred to the system and several machines of this type can be connected at the same time. For maximum safety, ESEC 3100 has a built-in functional test feature that checks the position of the materials, the pressure, and the temperature every time a bond is formed. To help streamline the bonding process, 3100 offers several settings. Users can adjust the speed, temperature, power, and time delay before the bonding process starts. The machine also allows the operators to monitor the temperature and current during the process, which helps to ensure a secure and quality bond. The bonder includes a programmable temperature memory and a connection for a monitor so that users can see the bonded area in real-time. In addition, ESEC 3100 offers a range of specifications to ensure it meets the user's requirements. It has been designed to operate in a Class 3 clean room environment (ISO 14644-1 Level 3) and is available with a choice of hot-bar or pressure bar configurations. The integrated Quality Assurance Unit (QAS) monitors key machine components, such as temperature, pressure, and inductance, to ensure the highest bond quality. Overall, 3100 is an efficient, reliable, and user-friendly hot-bar bonder that adapts to a variety of applications. It offers the user a variety of settings and features to ensure an optimal bond and its built-in safety features provide the assurance of a secure bond each and every time. ESEC 3100 is a great addition to any assembly line.