Used ESEC 3100 #9181263 for sale

ESEC 3100 is a fully automated, high-precision, electrostatic bonder designed for advanced wire bonding applications. This state-of-the-art equipment features a high-resolution vision system, an advanced wire alignment unit, a high-precision thermal imaging machine, and a bond head with precise control of pressure, position, and stitch count. This single-operator process enables the bonding of a variety of bonded wire materials such as gold, copper, and aluminum. 3100 bonder features a modular design that permits a range of configurations depending on the customer's application requirements. The bond head can be equipped with single or multiple needle assemblies and with an AC or DC current for optimizing a variety of bond materials. The advanced vision and thermal imaging systems offer increased accuracy, allowing for precise wire placement, ensuring that each bond meets exacting specifications. ESEC 3100 features user-friendly controls that permit single operator setup and operation. All operations and settings are displayed on the intuitive touch screen panel for easy access, providing smooth machine operations and quick setup. Additionally, the machine includes various diagnostics that continuously monitor the machine's functions and provide precise feedback on performance. It is capable of performing multiple bonding functions, including conventional ball, wedge, stitch, and bump bumping, as well as ribbon, fine, and large gold and copper. 3100's superior design and quality provide superior wire bonding characteristics. With its tight process control and high throughput, this tool is suitable for use in a demanding production environment. Its advanced features also provide users with the flexibility to reliably meet the customer's application requirements. ESEC 3100 bonder is designed to meet the needs of both today's and tomorrow's wire bonding operations.