Used RESEARCH DEVICES / RD AUTOMATION M8A #153554 for sale

RESEARCH DEVICES / RD AUTOMATION M8A bonder is a high performance semi-automatic die bonder developed and manufactured by RD AUTOMATION. It is used in microelectronics, fiber optics, medical device manufacturing, and other industries where accurate placement of components and bonding is required. RD AUTOMATION M8A bonder is highly versatile and reliable, providing users with an efficient and cost-effective solution for high precision die and component placement and bonding. RESEARCH DEVICES M-8A bonder is equipped with two independent XY precision stages, which provide optimal accuracy when placing and bonding components. The XY stages are driven by stepper motors and feature a repeatability of 5 microns. Additionally, the bonder features a vision equipment, giving users the ability to accurately place components even when the exact position is not known. The high resolution of RESEARCH DEVICES M8A bonder also makes it ideal for working with fine-pitch and ultra-fine-pitch substrates. The bonder's capability to be driven with finger tip control is also beneficial for precise placement and bonding of components. RESEARCH DEVICES / RD AUTOMATION M-8A bonder features a standard 4-inch x 6-inch working area and a 10-micron alignment accuracy, making it suitable for many types of manufacturing applications. For extra efficiency, users may employ optional accessories, such as a sub-micron vision system, a programmable heat source, and a high-accuracy adhesive dispenser. The sub-micron vision unit enables the bonder to precisely place components with a resolution of 1 micron. Additionally, the programmable heat source allows users to precisely control the temperature of the bonding head. The high-accuracy adhesive dispenser is used to precisely dispense various types of adhesives, such as ultrasonic adhesives, high temperature adhesives and eutectic adhesives. M-8A bonder is a semi-automatic workhorse, providing a reliable and cost-effective solution for precise die and component placement and bonding. RD AUTOMATION M-8A bonder's high resolution and repeatability, combined with its precision XY stages, makes it ideal for a wide range of applications, from microelectronics to fiber optics. Additionally, the versatile and powerful M8A bonder can be tailored to user-specific needs utilizing optional accessories, such as the sub-micron vision machine, the programmable heat source and the high-accuracy adhesive dispenser.