Used SHINKAWA UTC-2000 / UTC-2000 Super #9173705 for sale

SHINKAWA UTC-2000 / UTC-2000 Super is a high-precision, ultrasonic bonder designed specifically for bonding electronic components. It is designed to maximize accuracy and application flexibility. Utilizing a high-frequency ultrasonic wave pulse, the UTC-2000 Super is capable of properly bonding and closely connecting two metallic surfaces together with little or no heat. By using the specialized piezoelectric transducer mounted at the center of the weld head, it is effectively able to bond metal objects up to 1mm thick with an accuracy of up to 0.2mm. The UTC-2000 Super also features a user-friendly, cutting-edge control equipment that allows the operator to quickly set and adjust the parameters of the bonding process. It's high frequency output and pulse width are selectable to accommodate different material thicknesses and some other special requirements, while the power control allows for a fine-tuned adjustment of the bond power depending on the target application. The unit is also equipped with an optional fine-tuning mode for the optimum bond control and is available with either manual or automated cycle control. The UTC-2000 Super is equipped with a self-diagnostics system which constantly monitors the performance of the device and automatically adjusts to any environmental interference such as temperature and humidity changes, preventing potential errors in the bonding process. The device is also equipped with a powerful vacuum unit in order to keep the work pieces secure in place and precisely positioned during the operations. In addition, the reliable and long-lasting SHINKAWA UTC-2000 Super is designed to operate with minimal noise levels, vibration and dust with maximum efficiency and repeatability. The unit is compatible with SHINKAWA global supply of ultra-precise components and materials and can be used for a wide range of applications such as for Lead-Free bonding, memory cards, connectors and chip packages, capacitors, as well as other numerous electronic and industrial components. Overall, UTC-2000 / UTC-2000 Super is powerful and highly reliable, precision bonding device designed to handle a variety of tasks with accuracy and flexibility. The device provides exceptional performance with its user-friendly control machine, and is capable of bonding metals up to 1mm thickness with accuracy of up to 0.2mm. It is also equipped with a self-diagnostics tool, a vacuum asset, and operates with minimal noise levels, vibration and dust levels. The UTC-2000 Super is the perfect solution for a wide range of industrial applications such as Lead-Free bondings, memory cards, connectors, chip packages, and other numerous electronic and industrial components.