Used AMAT / APPLIED MATERIALS / HCT 500SD-B/5 #9185496 for sale

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AMAT / APPLIED MATERIALS / HCT 500SD-B/5
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ID: 9185496
Wire saws Machine: Wire speed / Acceleration maximum: 5 m/s / 18" Wire guides length: 520 mm Wire guides diameter: 300 mm Horizontal working space maximum: 360 mm (4) Wire guides Wire guides drives power: 2 x 61 kW Table: Travel maximum (Depends on clamping): 290 mm Cutting speed: 0 - 9000 mm/min Fast table speed: 0 - 500 mm/min Passive clamping system: Hydraulic (2) Tables Wire: (8) Pulleys Wire tension: 0-30 N Wire length maximum (For 0 160pm): 640 km Wire web width typical: 500 mm Slurry: Tank capacity: 550 liter Pumping capacity maximum (1,6 kg/dm3): 2 x 160-200 * kg/min Pump power: 3 x 7.5 kW Pumping speed adjustment: 0-100% (3) pumps (6) Manifolds in slicing rooms 2008-2009 vintage.
HCT 500SD-B/5 Crystal Growing, Sawing & Slicing Equipment is a crystal growth system designed to create, grow, and process semiconductor materials. It enables the production of accurately cut, polished, and diced substrates from a variety of materials. The unit is designed with a single-axis robot arm that can move along an X-Y-Z plane. The arm features a two-position, load locked stage for loading and unloading substrates, as well as a loading CAE for transferring materials from an external location. An optical sensor is used to detect the position of the substrate, enabling accurate cutting, drilling, grinding and polishing, and slicing operations. The machine also includes a powerful windows-based software that enables the user to automate many of the tool's operations, such as substrate positioning, cutting, polishing, and slicing. It also features a library of common material substrate types, enabling users to quickly and easily set up cutting recipes for a range of materials. The asset's laser-based cutting and drilling model can be used to achieve both complex geometries and intricate feature sizes. A specialized Pulsed Laser Machining (PLM) process is used to deliver extraordinary accuracy and surface finishing. The high-precision motorized diamond saw, operated with the touch of a button, is also integrated into the equipment for accurate slicing and polishing operations. AMAT 500SD-B/5 system is capable of supporting a wide variety of materials, including silicon, zinc sulfide, gallium arsenide, lead selenide, and diamond. Its processing capabilities include dicing, wire bonding, and laser marking. It also includes safety features such as emergency stop buttons and fume extraction systems, making it a reliable and safe solution for demanding production environments. The unit is also highly efficient, reducing the amount of human labor needed for these types of operations drastically. It is also constructed with a durable metal housing that ensures its long-term performance. As a result, APPLIED MATERIALS 500SD-B/5 is an effective machine for producing precise cuts for a variety of semiconductor materials.
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