Used MEYER BURGER DS 271 #9138091 for sale

MEYER BURGER DS 271 is a crystal growth, sawing and slicing equipment designed to meet the needs of the most demanding semiconductor processing environment. The system is built on the latest technological advancements and employs a unique combination of cutting-edge wafer thinning technologies to maximize overall efficiency and yield. The unit offers an innovative crystal growth architecture, which significantly lengthens the lifetime of wafers being processed. This is achieved through a combination of advanced oxidation technology, improved edge extraction, and an adjustable temperature profile. The crystal growth architecture results in higher crystal purity and better growth rate. MEYER BURGER DS271 also utilizes a precise and advanced diamond sawing machine to precisely cut through the wafers. The diamond saw offers excellent cutting capabilities with a maximum cut speed of 90 cuts per minute and a minimum cut speed of 30 cuts per minute. In addition, this tool can provide a maximum repeatable accuracy of 0.2mm. To ensure optimal slicing efficiency, DS 271 incorporates a state-of-the-art slicing technology. This slicing technology offers flexibility in terms of both slicing thickness and crystal size. The slicing accuracy is maintained at 0.3µm and the slicing speed range is 4 slices per minute. DS271 also provides excellent flexibility in terms of user control. The asset includes an easy-to-use interface that allows for a wide range of settings to be adjusted. This includes the ability to customize program settings for incline, sawing depth and feed rate, as well as the ability to monitor and control various aspects of the model such as coolant flow rate, cutting speed and more. Overall, DS 271 is an excellent choice for those looking for a crystal growth, sawing and slicing equipment with high performance. With the combination of advanced oxidation technology, precision diamond sawing and slicing technology, the system is perfect for efficient and reliable processing of wafers.