Used MEYER BURGER TS 116 #160564 for sale

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ID: 160564
Wafer Size: 4"-6"
Slicing Machine, 4" to 6" For automatic slicing of ceramic materials, ferrite, quartz, optical glass Slicing blade dia.: 100-150mm Controller: GE Fanuc Series O-M (1999 vintage) Fixed spindle speed range from 2500-8000 RPM Longitudinal path: 300 mm Cross path: 140 mm Vertical path: 100 mm Resolution in all 3 axes: 0.001 mm Feed speeds programmable from 5-2000 mm/min Workable: 300 x 150 mm Distance spindle axis workable: 50-150 mm 1989 vintage.
MEYER BURGER TS 116 is a cutting-edge, automated crystal growing and sawing/slicing equipment designed for cutting thin wafers from single crystal Ingots. The system has a small footprint and allows for the efficient production of wafers up to 6" diameter while accommodating a large selection of materials. The auto crystal growing unit is equipped with a multi-element furnaces with a single gate valve, allowing for efficient crystal growth in various material systems. The machine is capable of single crystal growth as well as polycrystalline growth, as well as tempering and melting processes. The user-friendly tool also includes integrated safety systems, PID control and vacuum compatibility, along with low-noise operation. The sawing/slicing stage of the asset is capable of cutting various types of thin wafers from a single ingot. With minimum material waste, the model produces high-precision thin wafers with high yields using the latest sawing technologies. A 6-axis control equipment operating together with the sawing unit ensures improved accuracy in wafer cutting and slicing. The system also offers updated usability features like parameter memory, integrated process control and monitoring, as well as a help-room for easy troubleshooting. In addition, TS 116 offering Industry 4.0 connectivity with real time process monitoring and data logging. An integrated weighing unit allows for automatic raw material loading and unloading of wedge-shaped material. Additionally, inter-process material transfer is provided via a buffer slide table, allowing for a faster and more efficient transfer of material between the crystal growth and wafer sawing/slicing stages. Overall, MEYER BURGER TS 116 is an advanced and efficient crystal growth and sawing/slicing machine, combining excellent usability features with a reliable and safe operation suitable for industrial production. With the tool's ability to produce high-quality thin wafers with minimal material waste, TS 116 is the perfect choice for cutting-edge crystal growing and sawing/slicing applications.
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