Used DATACON / BESI 2200 APM #9030513 for sale

BESI 2200 Automatic Die Attachment (APM) machine is an automated production system designed for die bonding applications. It is a single-step platform designed to operate in pick and place mode, allowing for the automatic and accurate placement and bonding of wire-bonded devices onto printed circuit boards (PCBs). It is capable of die placement onto the target substrate within a 2-micron tolerance and is programmed to ensure that the wire bonding is completed with optimal accuracy. DATACON / BESI 2200 APM machine utilizes a 5-axis system, consisting of four linear axes (X-Y-Z and Theta) and one rotational axis. At the heart of the machine is a pick and place head, which houses a precision-engineered pneumatic actuator and precision vision system. The pick and place head is programmed to quickly and precisely place the die at the exact substrate location, and then securely bonds the die using an electrically-welded bonding wire. The machine is designed with both manual and automated modes of operation. It can easily integrate with existing production systems to provide high quality, repeatable die-attachments. The pick and place head features a built-in LCD screen for an intuitive user interface and allows operators to adjust the placement and bond angle in order to optimize performance. For added control, the operator can also select various bonding parameters, such as flow and preheat levels. BESI 2200 APM machine is a robust solution for any die-bonding application. Its precise wire bonding and placement capabilities offer superior results without sacrificing productivity. The machine also offers easy maintenance and low start-up costs due to its simple construction and reliable operation. It is the ideal choice for producing reliable, high-quality wire bonds in the most demanding environment.