Used POLYFLOW S 620 #9114213 for sale

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ID: 9114213
Wafer Size: 8"
Omni-clean system, 8" FM4910 2002 vintage.
POLYFLOW S 620 is a diffusion furnace and accessorie designed to perform thin film deposition, and oxygenation processes in the field of microelectronics. This is a reliable and robust technology that has been developed to fulfill the industry's highest requirements, namely high purity, high throughput, and cost-effective deposition processes. S 620 is mainly designed for the application of conformal metallic films, such as gold or copper, for instance. It features an inert chamber with a precision pneumatically controlled atmosphere, ensuring the highest quality deposition in a repeatable process. The chamber is also constructed with careful attention to temperature-resistant requirements and robust isolation, allowing for uniform temperature throughout the components of the equipment. In addition to this, POLYFLOW S 620 has an excellent high-frequency medium that prevents heating in the system, and a long life time before refurbishing is necessary. S 620 offers a number of benefits over competitive models. Firstly, it produces the highest uniformity of film deposition on any given part surface, making for reduced overall material costs. Additionally, POLYFLOW S 620 is equipped with an advanced programmable logic controller (PLC) that allows for automated control of all unit processes. This makes for a very low footprint due to its compact design. Furthermore, this machine also includes a range of advanced accessorie options to enhance process capability and accuracy, such as a high performance wafer holding device, a vacuum process running tool, and a calibration and measurement tool. S 620 also excels in safety. It features a very low oxygen transport rate, low outgassing levels, and inert environment, which leads to a very safe operating environment, and meets strict industry safety standards. In addition, POLYFLOW S 620 is equipped with a self-contained protection asset whereby, in the event of a failure, the model shuts down without compromising the safety of the user. In conclusion, S 620 is an ideal solution for the diffusion of metals onto parts for microelectronics. Its advanced performance characteristics make it the ideal choice for high precision and cost-effective processes, while its robust and reliable safety measures provide the highest levels of security.
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