Used TEL / TOKYO ELECTRON Alpha 8S #155754 for sale

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ID: 155754
Furnace, 8" Process: Poly Safety specification: TEL Standard System paint color: Biege white System power rating: AC200V, 3P / AC100V, 1P Loading configuration: (4) Loaders / (127) Wafer slots Process pressure (Torr): Low pressure Process temperature: 600º C FTP Heater: Installed Rapid cooling unit: Installed Heater type: VOS-40-017 Process gases: Process gas MFC 1,2,3,4: N2 Process gas MFC 5, 6: SiH4 Process gas MFC 7, 8, 9: PH3 Gas system: Filter: MOTT Pou-20S-SV2, Ni Air valve: FUJIKIN: Diaphragm type Mega-mini and block MFC: STEC SEC-74 Series Check valve: FUJIKIN O-Ring seal type Hand valve: FUJIKIN: Diaphragm type Regulator: VERIFLO SQ Series Pressure transducer: NAGANO ZT 17 Others: Joint: Gasket type: Pure nickel type Piping material: SUS316L Up tube Piping working method: Welding Welding methods: Automatic welding Gas exhaust system: Dry pump: EBARA A150W-T Main valve: MKS 172-1080P Vacuum gauge: MKS Baratron sensor normal type Joint: Gasket JIS Method Piping material: SUS316BA, stainless steel APC: MKS 253B-3-80-2, butterfly valve VG1: 0 to 10 Torr, Normal type VG2: 0 to 1000 Torr, Normal type VG3: ULVAC GP-2A, Pirani gauge Manifold: Structure: Sealing method: End point sealing Material: SUS316L Stainless steel Port: Gas port: 3/8" Ultra torr Inner T/C port: 20DAI Ultra torr Exhaust port: 3 DIA Cooling method: Water cooling Safety Interlock: Gas flow low MFC: Too low gas flow Alarm: > 5% Abort: ± 10% Gas flow high MFC: Too high gas flow Alarm: > 5% Abort: ± 10% Low PCW flow: No PCW supply Alarm: > 3min Abort: > 5min Heater break down: > 7min PCW Leak detection: Alarm Process heater over temperature: Chamber over heat Heater break down: > 3 sec Furnace area over temperature: Alarm Heater break down: > 3 sec SCR Area over temperature: Alarm Heater break down: > 3 sec Interruption of electric power: Alarm Abort: < 3 sec Heater break down: > 3 sec Gas flow sequence: Alarm Pump off: Alarm Pump trouble: Alarm Pressure low (reactor tube pressure): Alarm Pressure high (reactor tube pressure): Alarm Leak check (reactor tube pressure): Main valve off delay: 10 min Abort: > 20mTorr Currently warehoused 1997 vintage.
TEL / TOKYO ELECTRON Alpha 8S is a diffusion furnace designed to help optimize and refine semiconductor processes through its innovative heating, extraction, and heat treatments of semiconductor wafers. An advanced thermal control equipment allows high precision temperature control of the entire process, producing consistent results. TEL ALPHA-8S offers a low temperature scanning and "Power Save" feature, safely and reliably creating optimum solder-bonding processes and barrier-film coating processes. TOKYO ELECTRON ALPHA 8 S is equipped with a high-performance exhaust extraction system that can be configured to ensure emission-free processing. It features two electro-thermal heaters with a maximum temperature of 1920°C, equipping the user with an efficient and safe way to anneal and heat-treat samples in a repeatable fashion with consistent results. TOKYO ELECTRON ALPHA-8 S is further equipped with continuous AUTO PECVD, with plenum gas-mixers that enable quick and easy unit maintenance. TOKYO ELECTRON Alpha 8S is a fully automated machine that is both intuitive and user-friendly. Its robust design includes features like enhanced programmability, powerful hardware control, and user defined alarm and program sequence settings. The tool is also scalable, allowing users to add components and upgrade capabilities over time. TEL Alpha 8S is further equipped with multiple accessories that ensure a safe and hassle-free experience. Among these accessories include an advanced filter asset that prevents any possible contamination. The vacuum sealing feature enables efficient, repeatable processes and a high-performance thermal break stoker model ensures uniformity throughout the sample. Finally, an optional PC Control mode allows users to easily access and manage data and program settings. ALPHA 8 S is a highly effective and efficient diffusion furnace, equipped with advanced features and accessories to ensure an optimally efficient semiconductor process. Its innovative design and features make this solution ideal for a range of complex and highly precise heat-treating, annealing, and coating processes.
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