Used TEL / TOKYO ELECTRON Alpha 8S #155754 for sale
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ID: 155754
Furnace, 8"
Process: Poly
Safety specification: TEL Standard
System paint color: Biege white
System power rating:
AC200V, 3P / AC100V, 1P
Loading configuration:
(4) Loaders / (127) Wafer slots
Process pressure (Torr): Low pressure
Process temperature: 600º C
FTP Heater: Installed
Rapid cooling unit: Installed
Heater type: VOS-40-017
Process gases:
Process gas MFC 1,2,3,4: N2
Process gas MFC 5, 6: SiH4
Process gas MFC 7, 8, 9: PH3
Gas system:
Filter: MOTT Pou-20S-SV2, Ni
Air valve: FUJIKIN: Diaphragm type
Mega-mini and block
MFC: STEC SEC-74 Series
Check valve: FUJIKIN O-Ring seal type
Hand valve: FUJIKIN: Diaphragm type
Regulator: VERIFLO SQ Series
Pressure transducer: NAGANO ZT 17
Others:
Joint: Gasket type: Pure nickel type
Piping material: SUS316L Up tube
Piping working method: Welding
Welding methods: Automatic welding
Gas exhaust system:
Dry pump: EBARA A150W-T
Main valve: MKS 172-1080P
Vacuum gauge: MKS Baratron sensor normal type
Joint:
Gasket
JIS Method
Piping material: SUS316BA, stainless steel
APC: MKS 253B-3-80-2, butterfly valve
VG1: 0 to 10 Torr, Normal type
VG2: 0 to 1000 Torr, Normal type
VG3: ULVAC GP-2A, Pirani gauge
Manifold:
Structure:
Sealing method: End point sealing
Material: SUS316L Stainless steel
Port:
Gas port: 3/8" Ultra torr
Inner T/C port: 20DAI Ultra torr
Exhaust port: 3 DIA
Cooling method: Water cooling
Safety Interlock:
Gas flow low MFC:
Too low gas flow
Alarm: > 5%
Abort: ± 10%
Gas flow high MFC:
Too high gas flow
Alarm: > 5%
Abort: ± 10%
Low PCW flow:
No PCW supply
Alarm: > 3min
Abort: > 5min
Heater break down: > 7min
PCW Leak detection: Alarm
Process heater over temperature:
Chamber over heat
Heater break down: > 3 sec
Furnace area over temperature: Alarm
Heater break down: > 3 sec
SCR Area over temperature: Alarm
Heater break down: > 3 sec
Interruption of electric power: Alarm
Abort: < 3 sec
Heater break down: > 3 sec
Gas flow sequence: Alarm
Pump off: Alarm
Pump trouble: Alarm
Pressure low (reactor tube pressure): Alarm
Pressure high (reactor tube pressure): Alarm
Leak check (reactor tube pressure):
Main valve off delay: 10 min
Abort: > 20mTorr
Currently warehoused
1997 vintage.
TEL / TOKYO ELECTRON Alpha 8S is a diffusion furnace designed to help optimize and refine semiconductor processes through its innovative heating, extraction, and heat treatments of semiconductor wafers. An advanced thermal control equipment allows high precision temperature control of the entire process, producing consistent results. TEL ALPHA-8S offers a low temperature scanning and "Power Save" feature, safely and reliably creating optimum solder-bonding processes and barrier-film coating processes. TOKYO ELECTRON ALPHA 8 S is equipped with a high-performance exhaust extraction system that can be configured to ensure emission-free processing. It features two electro-thermal heaters with a maximum temperature of 1920°C, equipping the user with an efficient and safe way to anneal and heat-treat samples in a repeatable fashion with consistent results. TOKYO ELECTRON ALPHA-8 S is further equipped with continuous AUTO PECVD, with plenum gas-mixers that enable quick and easy unit maintenance. TOKYO ELECTRON Alpha 8S is a fully automated machine that is both intuitive and user-friendly. Its robust design includes features like enhanced programmability, powerful hardware control, and user defined alarm and program sequence settings. The tool is also scalable, allowing users to add components and upgrade capabilities over time. TEL Alpha 8S is further equipped with multiple accessories that ensure a safe and hassle-free experience. Among these accessories include an advanced filter asset that prevents any possible contamination. The vacuum sealing feature enables efficient, repeatable processes and a high-performance thermal break stoker model ensures uniformity throughout the sample. Finally, an optional PC Control mode allows users to easily access and manage data and program settings. ALPHA 8 S is a highly effective and efficient diffusion furnace, equipped with advanced features and accessories to ensure an optimally efficient semiconductor process. Its innovative design and features make this solution ideal for a range of complex and highly precise heat-treating, annealing, and coating processes.
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