Used ANGSTROM SUN TECHNOLOGIES SE200BMC #9130298 for sale

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ID: 9130298
Probe spectroscopic ellipsometer Wavelength range: 250-1000 mm Incidence angle range: 10-90 degrees at 5 degree interval Incident angle change: 5 manual Measurement time: 1-3 s whole spectra Beam size: 1 to 5 mm adjustable Measurement type: film thickness, optical constants Measurable thickness range: up to 30 um Data acquisition: automatic Operation modes: engineer mode and operator mode Light source: 75W xenon lamp arc light source NK database: over 300 NK table included Control: Intel dual core processor and 19" LCD monitor Software advanced TFprobe 3.3 for simulation.
ANGSTROM SUN TECHNOLOGIES (AST) ANGSTROM SUN TECHNOLOGIES SE200BMC Bonder is a powerful and highly advanced bonder or packaging machine that allows for the precision handling of delicate components. This machine is designed for the mass production of a wide range of electronic components and devices, primarily in the semiconductor, communications, aerospace, and medical industries. SE200BMC features a modular design, allowing for the customization of the machine's specific capabilities to match the demands of the intended applications. Telescopic alignment and a wide variety of selectable feature sets ensure that every package of components is produced quickly, efficiently, and without any defects. ANGSTROM SUN TECHNOLOGIES SE200BMC features a precision motion controller that ensures that each completed joint is perfect. This advanced motion control system allows for precise placement and welding during the bonding process. This is key to ensuring that all components are joined properly and without any defects. The bonding process is performed utilizing a special bonding fluid that is applied directly to the component's surfaces. This fluid helps create the perfect bond as it allows for improved adhesiveness at the molecular level. Thanks to this advanced bonding technology, SE200BMC can easily pass all the Mil-Spec tests and perform flawlessly in the most challenging applications. Thanks to its high-accuracy pick and place heads, ANGSTROM SUN TECHNOLOGIES SE200BMC can pick up and pass components securely and accurately without any issues. The machine also utilizes its incorporated vision system to ensure that the component is correctly placed and maintains the component's relative position even after the bonding process. Furthermore, SE200BMC features a powerful communications system that allows for seamless connection with other equipment, quickly transferring data for easier and faster operation. Thanks to its reliable and secure connection, the machine can maintain the accuracy and integrity of critical messages and data transfer. In the end, ANGSTROM SUN TECHNOLOGIES SE200BMC Bonder is the perfect machine for any mass production of components and devices that require high-precision and accuracy. Its advanced features, cutting-edge technology, and robust design make it one of the most advanced bonders available on the market.
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