Used AMAT / APPLIED MATERIALS Centura ACP RP #9096042 for sale

Name: AMAT / APPLIED MATERIALS Centura ACP RP
Brand: AMAT / APPLIED MATERIALS
SKU: 9096042
Availability: SoldOut

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Reactors

Manufacturer

AMAT / APPLIED MATERIALS

Model

Centura ACP RP

ID: 9096042

Wafer Size: 12"

Epitaxial silicon (EPI) System, 12" Position A: Yes Position B: Yes Position C: Yes Position D: Yes System software: B2.7_39 FiCGUI: fB4.90_15 Beta GP: gB7.50_11 WIP Delivery type: OHT WIP delivery (2) Load ports Remote control system capable: NO eDiagnostics ready: Yes Docked E99 reading capability: Yes Load port types: Enhanced 25-Wafer FOUP Docking flange shield: Yes Air intake system: Top intake E84 carrier handoff: Upper E84 interface enabled OHT E84 PIO sensors and cables: Upper E84 sensor an cable E99 Carrier ID: TIRIS With RF Operator access switch: Yes Carrier ID host interface: No OHT Light curtain: Light curtain SECS Trace: Yes Single axis aligner: Single axis aligner Robots: No Mainframe type: CORE ENP BLOCK 2 LL: Batch load lack Chamber Interface: Vented stainless stell insert Pumps: Process pump: EDWARDS iH1000SC, 100 Hz Transfer Pump: ALCATEL ADS602 LL Pump: ALCATEL ADS602 Baratrons : MKS Lift Pins: Hollow silicon carbide graphite Recipe control AccuSETT: Yes Lamp type: USHIO 0190-31284 Process temperature: PID Control real time display Emissivity: 0.55 to 0.75 upper and 0.6 to 0.8 lower Upper/Lower Gain (kw/C): 0.5 NOT allowed to adjust but capable Upper/Lower TI (sec): 10s Upper 20s Lower Gas panel feed: Bottom Pump purge: YES Regulators and displays Transducers and regulators SiH2CI2 Stick 07: DCS (500 sccm) HCl Stick 03: HCL (500 sccm) SiH4 tick 04: SIH4 (500 sccm) H2 NIL H2 Main Stick 01: Purge main (100000 sccm) H2 Slit Stick 02: Purge slit (30000 sccm) 3 degree flared in upper outer threaded upper inner: threaded upper inner 0041-01969 FTGNIP QDISC: FTGNIP QDISC 3/8BODY X 3/8-18FP1.71"LSST303 3300-01720 Phase II hardware Shaft 6-arm susceptor support: Reflector Base Lower mid Top Lower mid H2 Purifier: Yes Currently de-installed.

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AMAT / APPLIED MATERIALS Centura ACP RP is an advanced, high performance plasma etch processing reactor for semiconductor manufacturing. It has a highly efficient deposition system, with a specially designed sputtered electrode and the patented Costar Rotatable Process (CRP) equipment for precise control of process parameters. The CRP allows for process optimization and improved yield through careful process control and accurate deposition. The ACP RP is designed for a range of semiconductor processing requirements, including CMOS and III-V devices. It is capable of both in-situ physical and chemical deposition, offering higher process control through advanced precision and accuracy. The ACP RP reactor is powered by RF plasma, providing an effective and efficient plasma source for the production of a variety of materials for semiconductor applications. The reactor has a broad process capability from etching and ion implantation to selective deposition. It utilizes proprietary software and patented Costar Rotatable Process to precisely align the electrodes and the plasma paths for optimal deposition of layers over the wafer. The system also features a highly efficient vacuum systems, with a specialized process chamber for improved uniformity of deposition. This allows for higher uniformity over the entire length of the deposition process. The special process chamber reduces the noise levels and improves the depositions performance. In addition, the ACP RP features e-Beam Driven Process Sources (EBPS), which enables rapid etching, ion implantation, and other plasma processing techniques in a single step. The ACP RP is equipped with an advanced control system, which allows for precise and accurate control of the process parameters. This ensures reproducible, high-yield results, making the ACP RP suitable for a wide range of applications. Additionally, the ACP RP is easily expandable, with optional features such as rotatable platen, Unigy Electrostatic Chuck (ESC), RoboSTAT Process Control Software, and more. All of these features ensure consistent and predictable results, enabling optimized throughput and improved yield in a production environment. The ACP RP is designed for a fast, trouble-free operation, and offers outstanding features, making it suitable for a variety of semiconductor manufacturing processes. Its advanced RF plasma source and high-precision process control make it a great choice for any process requiring reliability and accuracy. With its robust design and performance, AMAT Centura ACP RP is an ideal choice for high volume and complex plasma etch processing tasks.