Used AMAT / APPLIED MATERIALS Centura DPS+ #9093676 for sale

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ID: 9093676
Wafer Size: 8"
Vintage: 1997
Poly etcher, 8" (2) Chambers WBLL Wafer shape: SNNF, notch SMIF interface; no MF facilities: bottom System power: 208V/400A Loadlock pump type: EBARA/ESR20N Buff pump type: EBARA/ESR20N Buff robot type: HP Buff robot blade: SUS Software revision: E5033 1997 vintage.
AMAT / APPLIED MATERIALS Centura DPS+ reactor is a durable, fully automated and versatile processing equipment for both front and back-end processes in semiconductor manufacturing. The system is designed to provide optimal process results for wafer epitaxy, ion implantation, metal CVD, and ALD processes. The reactor is composed of five primary subsystems- the workstation, processing chamber, controller, exhaust plenum, and heater element. The workstation is designed to provide the necessary illumination, movement, and alignment for the robotic arm of the unit, as well as accuracy in wafer loading and unloading. The processing chamber itself is comprised of a vacuum chamber, and can be evacuated to pressures as low as 0.06 Torr, which provides a pure and particle-free environment for deposition, implantation, and other processes. The interior of the chamber is also designed to prevent buildup of films, particles, and other material, while a heat exchanger maintains a uniform process temperature. The controller of the DPS+ is responsible for executing the commands from an applied recipe, as well as making the necessary adjustments and decisions to optimize the process results. The interface is user-friendly, allowing for both manual adjustment and automation. The exhaust plenum of the machine is responsible for collecting process byproducts, and for minimizing the thermal load within the chamber. Finally, the heater element of the reactor is adjustable, and can be set to a wide range of temperatures, providing further versatility. All together, AMAT Centura DPS+ is designed to provide optimal processing results in semiconductor manufacturing, while being fully automated and efficient. The flexibility of the tool also allows for a wide range of materials to be processed, from group IV materials to group III-V compound materials. The versatility of the reactor also makes it an ideal choice for front-end applications, such as epitaxy and ion implantation, as well as for back-end applications, such as Metal CVD and ALD.
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