Used LAM RESEARCH / DRYTEK DRIE-100 #164804 for sale

ID: 164804
Cassette planar plasma wafer etcher Specifications: Uses chlorine- and fluorine-based chemistries for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films Selectivity: e.g., 20:1 poly Si:SiO2 Laser interferometer for etch rate determination and end-point detection Various Accessories & Wafer Holders Included Complete Manuals Included Leybold-Heraeus D60A Trivac Rotary Vane Vacuum Pump available Leybold-Heraeus D60A Trivac Rotary Vane Vacuum Pump w/Breaker Box available Deinstalled.
LAM RESEARCH / DRYTEK DRIE-100 is a reactive ion etcher and asher equipment that is used to produce nanometer and micron-scale features on thin film substrates. Its high-performance, precision engineering and easy-to-use controls make it the ideal tool for a number of advanced materials processing applications. DRYTEK DRIE-100 has a large chamber size and can handle substrates up to 200 mm in diameter. It provides a high level of selectivity for a range of thin film materials, including metals, polymers, silicon, germanium, and organics. The etch and asher processes can be tailored to minimize carbon and fluorocarbon-containing gases, which results in enhanced selectivity and uniform etching of features. LAM RESEARCH DRIE-100 features a power supply that controls the etching process, a substrate holder, an RF (radio frequency) generator, and a gas control unit. The control system of DRIE-100 can be programmed to process a wide range of thin film materials and set up various process parameters, such as pressure, RF power, anode/cathode spacing, argon flow, and etching time. In addition, LAM RESEARCH / DRYTEK DRIE-100 can support multiple process modes, including traditional reactive ion etch (RIE) and dual stage clean/etch to minimize contamination. It also provides the option of using photo-activated etching for increased selectivity. DRYTEK DRIE-100 is equipped with an advanced pressure control unit, coupled with a series of vacuum modules for improved wafer stability and uniformity in etching. LAM RESEARCH DRIE-100 was designed with safety in mind and includes ensuring high-precision, repeatable, and reliable results. Its software includes user-configurable parameters, as well as functions such as endpoints, non-volatile memory, real time clock, and a fast-target autofocus feature. The machine is also equipped with built-in diagnostics and self-testing capabilities. DRIE-100 is a powerful and versatile etcher/asher tool for R&D and pilot production applications. Its advanced design, incorporating easy-to-use controls and advanced pressure control, ensures fast, repeatable, and reliable results. With its dynamic capabilities and robust construction, LAM RESEARCH / DRYTEK DRIE-100 is a reliable tool to create nanometer- and micron-scale features with high selectivity
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